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The description of a chip carrier type plastic encapsulation for a semiconductor integrated circuit. The kit contains a lead frame member for reel-to-reel automatic processing made from a continuous metal tape. The lead frame member provides all necessary connections between electrodes on the semiconductor chip’s active or front surface and contact parts outside of the encapsulation.
The rear surface of the semiconductor chip is electrically and thermally connected to the lead frame member’s integral backside contact members. Similar to the front contact parts, the rear contact members are a part of the moulded plastics enclosing body.A high degree of automation fabrication is possible for the package, including handling in stick-type magazines for later processes like testing, ageing, and assembly. The package can be produced in very small sizes.
The Global plastic encapsulated semiconductor chips market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
In the UK, lter Technology has begun mass producing plastic-encapsulated QFN chip packages.The Alter UK plant in Livingston, Scotland, offers a crucial capability in the UK as the majority of semiconductor packaging is done in big outsourced assembly and test (OSAT) production lines in Asia.
There are just a few facilities in Europe having this capability, and Alter is one of them.In the past, ceramic and metal packages were used for low-volume semiconductor packaging in the UK, and batch sizes were restricted to 100 or so devices manufactured serially. This is adequate for prototype and demanding settings but not ideal for the bulk of semiconductor packaging applications.
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