PRESSURE-LESS SINTERING DIE ATTACH PASTE MARKET

INTRODUCTION

Although silver sintering has been around, it has recently received more attention and found more utility as a result of advancements in nanoparticle materials, increased focus on energy and environmental sustainability, and widespread acceptance of lead-free legislation worldwide. 

PRESSURE-LESS SINTERING DIE ATTACH PASTE MARKET SIZE AND FORECAST

The Global Pressure-Less Sintering Die Attach Paste market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

PRESSURE-LESS SINTERING DIE ATTACH PASTE MARKET DYNAMICS 

Henkel announced the commercialization of LOCTITE ABLESTIK ABP 8068TD, the newest in its line of pressure-free sintering die attach materials.

This high thermal die attach paste was created for use in applications where die back-side metallization is not necessary, though it can be used if desired.

Due to the material's versatility, semiconductor makers now have the option to integrate bare silicon (Si) dies with high thermal conductivity dies that are especially well-suited for high power applications.

Henkel created and released its pressure-less sintering die attach paste platform in response to issues with the usage of standard high-lead solder, the thermal conductivity restrictions of conventional die attach materials, and the manufacturing complexity of pure silver sintering solutions.

Henkel's pressure-less sintering materials have a special chemistry that enables the formation of an interpenetrating network of silver (Ag) and resin, enabling excellent interface contact, high thermal conductivity, and good thermal cycling reliability. These materials are applied and processed in the same manner as conventional die attach adhesives.

PRESSURE-LESS SINTERING DIE ATTACH PASTE MARKET COMPANY PROFILE

• Heraeus
• Kyocera
• Indium
• Alpha Assembly Solutions
• Henkel
• Namics
• Advanced Joining Technology

THIS PRESSURE-LESS SINTERING DIE ATTACH PASTE MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

1. What is the average cost perGlobal Pressure-Less Sintering Die Attach Paste market right now and how will it change in the next 5-6 years?
2. Average cost to set up aGlobal Pressure-Less Sintering Die Attach Paste marketin the US, Europe and China?
3. How manyGlobal Pressure-Less Sintering Die Attach Paste marketare manufactured per annum globally? Who are the sub-component suppliers in different regions?
4. What is happening in the overall public, globally?
5. Cost breakup of aGlobal Pressure-Less Sintering Die Attach Paste market and key vendor selection criteria
6. Where is theGlobal Pressure-Less Sintering Die Attach Paste market  manufactured? What is the average margin per equipment?
7. Market share ofGlobal Pressure-Less Sintering Die Attach Paste market manufacturers and their upcoming products
8. The most important plannedGlobal Pressure-Less Sintering Die Attach Paste market in next 2 years
9. Details on network of majorGlobal Pressure-Less Sintering Die Attach Paste market and pricing plans
10. Cost advantage for OEMs who manufactureGlobal Pressure-Less Sintering Die Attach Paste market in-house
11. 5 key predictions for next 5 years inGlobal Pressure-Less Sintering Die Attach Paste market
12. Average B-2-BGlobal Pressure-Less Sintering Die Attach Paste market price in all segments
13. Latest trends inGlobal Pressure-Less Sintering Die Attach Paste market , by every market segment
14. The market size (both volume and value) ofGlobal Pressure-Less Sintering Die Attach Paste market in 2024-2030 and every year in between?
15. Global production breakup ofGlobal Pressure-Less Sintering Die Attach Paste market , by suppliers and their OEM relationship