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Although silver sintering has been around, it has recently received more attention and found more utility as a result of advancements in nanoparticle materials, increased focus on energy and environmental sustainability, and widespread acceptance of lead-free legislation worldwide.
The Global Pressure-Less Sintering Die Attach Paste market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Henkel announced the commercialization of LOCTITE ABLESTIK ABP 8068TD, the newest in its line of pressure-free sintering die attach materials.
This high thermal die attach paste was created for use in applications where die back-side metallization is not necessary, though it can be used if desired.
Due to the material’s versatility, semiconductor makers now have the option to integrate bare silicon (Si) dies with high thermal conductivity dies that are especially well-suited for high power applications.
Henkel created and released its pressure-less sintering die attach paste platform in response to issues with the usage of standard high-lead solder, the thermal conductivity restrictions of conventional die attach materials, and the manufacturing complexity of pure silver sintering solutions.
Henkel’s pressure-less sintering materials have a special chemistry that enables the formation of an interpenetrating network of silver (Ag) and resin, enabling excellent interface contact, high thermal conductivity, and good thermal cycling reliability. These materials are applied and processed in the same manner as conventional die attach adhesives.