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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
Chips that combine pseudo-static random-access memory (PSRAM or PSDRAM) combine the greatest aspects of SRAM and DRAM memory compute units. A DRAM chip called PSRAM has an internal refresh function that eliminates the need for an externally enabled data rewrite onto its MOS capacitor.
Random access memory (RAM) that preserves data bits in its memory as long as power is being supplied is known as SRAM (static RAM).
SRAM lacks this requirement, which improves performance and uses less power compared to dynamic RAM (DRAM), which must constantly be refreshed.The SRAM performs the first function, acting as the interface between the CPU and DRAMs as cache memory.
The Global Pseudo SRAM market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Hynix Increases Product Offering For Pseudo-SRAM In Mobile Applications The Pseudo SRAM from several customers has been successfully validated for use in next-generation mobile applications, according to hynix Semiconductors Inc.
Using its.15-micron process technology, hynix is currently mass producing its 16M and 32M Pseudo SRAM chips. By the first quarter of 2019, the company anticipates starting mass manufacturing of its 64M-density device.Instead of using a structure with six transistors, pseudostatic RAM architecture uses one.
As a result, mobile phone manufacturers can increase the number of functions they offer without sacrificing the phones' competitive pricing, compact design, or fast operating system.
Hynix Pseudo SRAMs provide supply and I/O voltages of 1.8 to 3.0 volts, access times of 75 or 85 ns, and can operate in deep power-down mode with as little as 2-microamps of current consumption.
By enhancing performance, lowering power consumption, and prolonging battery life, these features enable widespread implementation in next-generation mobile applications.
Hynix not only holds a dominant position in the pseudo-SRAM market, but it has also started supplying low-power DRAMs for use in next-generation mobile applications and will start mass producing its NAND Flash by the first quarter The primary global vendor of integrated solutions for the mobile memory industry is Hynix.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introdauction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in theIndustry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |