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Last Updated: Apr 25, 2025 | Study Period: 2022-2030
Making electronic components and circuits resistant to damage or malfunction brought on by high levels of ionising radiation (particle radiation and high-energy electromagnetic radiation) is a process known as radiation hardening.
It is particularly useful for environments in outer space (especially beyond low Earth orbit), near nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
Radiation-hardened (rad-hard) components are based on their non-hardened equivalents but include some design and manufacturing changes that lower the susceptibility to radiation damage.
The majority of semiconductor electronic components are sensitive to radiation damage.
Radiation-hardened chip technology tends to lag behind more recent advancements because radiation-tolerant microelectronic chip designs require significant development and testing.
To connect a single source to numerous destinations, a demultiplexer is needed. Demultiplexers are mostly employed in communication systems, which employ multiplexers.
The majority of communication systems are bidirectional, or they work both ways (transmitting and receiving signals).
The Global radiation hardened demultiplexer market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Eight independent inputs and outputs (Y0 to Y7), three address inputs (S0 to S2), an active LOW enable input (), and a common input/output are all features of the radiation-hardened eight-channel analogue multiplexer demultiplexer SC1018-0T1 (Z).
Eight bidirectional analogue switches are present in the device, each of which has one side connected to a separate input or output (Y0 to Y7) and the other side to a shared input or output (Z).
The supply voltage connections for the digital control inputs (S1 through S3, and ) are VDD and VSS.The analogue inputs/outputs (Y0 to Y7, and Z) can alternate between VSS as a negative limit and VDD as a positive limit.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
21 | Product installation rate by OEM, 2022 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2022 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |