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Last Updated: Apr 25, 2025 | Study Period: 2022-2030
One of the major difficulties in designing nanoscale integrated circuits for aeronautical equipment is radiation. Standard cell libraries that can withstand radiation must serve as the foundation for the construction of aerospace chips.
A method to improve reliability in the chip design process is called design for testability (DFT), and the scanning D flip-flop is the essential component needed for testability design.
The radiation protected scan D flip-flops are built and confirmed at the circuit and layout levels in an effort to address the issue of the lack of scanning D flip-flops in the radiation resistant standard cell library of SMIC 0.18um. As evidenced by the simulation outcomes, the radiation-hardened scanning D flip-flop possesses
A number of radiation-hardened D-type flip flops are used in a programmable phase frequency divider for space applications that is implemented in CMOS technology.
In the case of a single event upset (SEU), radiation-hardened D-type flip flop circuits are built to continue operating normally at GHz frequencies.
The brand-new D-type flip flop circuits are made up of a master latch and a slave latch that are linked together and have two pairs of complementary inputs and outputs.
Due to the dual complimentary inputs and outputs and mutually interlinked dual interlocked cell (DICE) configuration of the master and slave latches, the D-type flip flop is immune to a SEU impacting at most one of the dual complementary inputs and outputs.
The Global radiation hardened octal D-type flip-flop marketaccounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
A noninverting radiation-hardened semiconductor, the Intersil HCTS374MS positive edge triggered, octal D-type flip-flop with three output states. Eight flip-flops are used to input data.
respective registers throughout the clock's transition from LOW to HIGH (CP). During this transition, data is also sent from the inputs to the outputs. The three-state outputs are controlled by the output enable (OE) which does not depend on the register operation.
once the outputs have a high output enable and a high output impedance state. The HCTS374MS makes use of sophisticated CMOS/SOS technology to operate at a high speed.
This gadget is a part of the High-speed, radiation-resistant CMOS/SOS logic family. The HCTS374MS is delivered in a flatpack of 20 lead ceramic.or an SBDIP Package (K suffix) (D suffix).
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
| 21 | Product installation rate by OEM, 2022 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2022 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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