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Underfill is one of the Flip-Chip processes for encapsulation. Underfill materials are filled by capillary application due to the thin gap between chips and substrates, and usually, the underfill materials are placed along the periphery of one or two sides of the chip.
An underfill is a composite material made up of an epoxy polymer with significant amounts of filler. Additional components added to the underfill formulation are flow agents, adhesion promoters, and dyes.
Although primarily used for flip-chip devices, underfills can also be used with ball-grid arrays (BGAs) and CSPs.A moulded underfill flip-chip package is a semiconductor package in which the narrow gap between IC chip and a substrate is filled with mould resin.
Both filling the gap under the IC chip and the moulding of the package are accomplished simultaneously.The Capillary Underfill process is used to encapsulate the bottom side of a silicon die.
The word “encapsulation” typically means to cover a top surface where fragile interconnects are located, but in this case, the fragile interconnects are on the bottom side of the die.
An underfill, typically an epoxy composition, connects the chip to the board by capillary action and then is heated to cure. The underfill material provides mechanical reinforcement to the solder joints which can increase the life of the chip.
Global semiconductor capillary underfill market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
Henkel unveils semiconductor capillary underfill for advanced silicon node flip chip applications.Henkel today announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications.
The material, Loctite Eccobond UF 9000AG, enables advanced silicon (Si) node flip chip integration by providing robust interconnect protection and compatibility with high-volume manufacturing environments.
While the company has well-established pre-applied paste and film underfill materials for leading-edge chip technologies, this development broadens Henkel’s post-applied capillary portfolio for flip chips with advanced node scaling.
Loctite Eccobond UF 9000AG breaks past conventional formulation paradigms, balancing high filler loading and fast flow capability to meet the extreme reliability and volume demands of next-generation semiconductor device packaging.
Already proven in mass production environments with the latest node and currently under evaluation for next-generation node flip chip packages, the product is an epoxy-based underfill designed with a high glass transition temperature (Tg) and ultra-low (<20 ppm) coefficient of thermal expansion (CTE).
Though among the market’s highest filled (>70%) formulations to enable excellent bump protection, it still underfills 30% faster as tested against previous-generation and competitive CUFs
