
- Get in Touch with Us
Last Updated: Apr 25, 2025 | Study Period: 2024-2030
A semiconductor carrier tape is a type of packaging material that is used to store and transport semiconductor devices such as integrated circuits, resistors, capacitors, transistors, etc It consists of a carrier tape with specially designed cavities that hold individual components, and a cover tape that seals the carrier tape to retain the components in the cavities.
The carrier tape is usually made of plastic or metal foil, and has sprocket holes along its edges for alignment and feeding purposes The cover tape is usually made of plastic film or paper with adhesive on one side The carrier tape and the cover tape are wound on a reel for easy handling and storage.
Semiconductor carrier tapes are used to feed components to automatic placement machines for surface mounting on board assemblies They provide protection and isolation for the components during shipping, handling, and processing They also enable high-density packaging and reduced footprint on the printed circuit board.
Semiconductor carrier tapes work by storing and transporting semiconductor devices in a secure and efficient manner. They work as follows:The semiconductor devices are placed in the cavities of the carrier tape by a pick-and-place machine or a manual loader.The cover tape is applied over the carrier tape and pressed firmly to seal the cavities and prevent the devices from falling out.
The carrier tape and the cover tape are wound on a reel and packed in an antistatic bag or box for shipping and storage.The reel is loaded on an automatic placement machine that unwinds the carrier tape and feeds it through a sprocket wheel that aligns the tape with the placement head.The cover tape is peeled off from the carrier tape by a peeling device and collected in a waste bin.
The placement head picks up the devices from the cavities of the carrier tape and places them on the board assembly.
The Global semiconductor carrier tape market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
WLCSP, fan out, multi-stack assembly, and other packaging technologies result in thin and tiny designs. 3M offers raised-platform 3MTM Polycarbonate Carrier 3000R Series carrier tape technology to match design trends, minimising die rotation, tilting, and chip migration, as well as component damage and waste that can occur when using thin and compact designs in tape-and-reel forms.
3M carrier tapes, which are ideal for compact die designs, enabling semiconductor makers to manage pocket opening radii to within 0.1 mm. Such tight controls aid in chip retention, limiting chipping and cracking while increasing throughput and yield.
SUMILITE® CSL-Z is a type ofcover tape that is used to seal carrier tapes for semiconductors and electrical components packing for SMT process. It is a product of Sumitomo Bakelite Co., Ltd.,
a Japanese company that specializes in various films and sheets for industrial and packaging applications2. SUMILITE® CSL-Z has features such as:Tearing-free at high speed mounting process.Wide sealing operation rangeSuperior sealing stabilityHigh stronger reliability at high temp and humidityEnhanced surface resistance on both sides under dry condition
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |