Global Semiconductor Encapsulation Material Market 2024-2030
  • CHOOSE LICENCE TYPE
Consulting Services
    How will you benefit from our consulting services ?

Global Semiconductor Encapsulation Material Market 2024-2030

Last Updated:  Apr 25, 2025 | Study Period: 2024-2030

SEMICONDUCTOR ENCAPSULATION MATERIAL MARKET

 

INTRODUCTION

 semiconductor chip is wrapped in a specific material as part of the "encapsulation process," which shields packages from the outside environment.Additionally, it is a step that reveals the qualities of "light, thin, short, and small" that packages seek to achieve.

 

Encapsulation's goal is to surround the component in protection without actually embedding it. It improves electrical insulation, flame retardancy, and heat dissipation while providing resistance to significant threats like shock, vibration, moisture, and corrosive agents.

 

Commonly used materials in packaging Cardboard boxes. Corrugated boxes. Glass Containers. Shrink Wrap. Cling Film. Woven Sack.Jute Bags. Intermediate Bulk Containers. Epoxy and acrylate resin based sealing and molding compounds are often used in electronics to protect electronic components, semiconductors and subassemblies. The encapsulation protects components from moisture, dust, dirt and solvents.

 

SEMICONDUCTOR ENCAPSULATION MATERIAL MARKET SIZE AND FORECAST

 

Infographic: Semiconductor Encapsulation Material Market , Semiconductor Encapsulation Material Market Size, Semiconductor Encapsulation Material Market Trends, Semiconductor Encapsulation Material Market Forecast, Semiconductor Encapsulation Material Market Risks, Semiconductor Encapsulation Material Market Report, Semiconductor Encapsulation Material Market Share

 

 

Global semiconductor encapsulation material market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

 

SEMICONDUCTOR ENCAPSULATION MATERIAL MARKET NEW PRODUCT LAUNCH

Panasonic Launches Delamination-free Semiconductor Encapsulation Material CV8213 Designed to Improve the Reliability and Extend the Operating Life of Semiconductor Packages.

 

Panasonic Corporation announced the commercialization of a new delamination-free  semiconductor encapsulation material designed for semiconductor packages use in automotive and industrial applications.

 

Full-scale production begins in January 2019. This product improves the reliability and extends the life of semiconductor packages operating in elevated temperature environments.

 

The operating temperatures of the power semiconductors used in automotive and industrial equipment applications are rising.

 

Reduced device sizes, higher current operation, and more modular designs are the causes of this trend. Interfacial adhesion loss between the lead frame (*2) and semiconductor encapsulation material is a common cause of failures in semiconductor packages, especially those used in high-temperature environments.

 

Differences in the linear coefficient of expansion characteristics between the lead frame and the encapsulating material frequently cause this kind of delamination.

 

Panasonic has released a new delamination-free  semiconductor encapsulation material that uses a special resin design in conjunction with reaction control technology to solve this issue. This item meets the AEC-Q100, Q101/Grade 0 ( reliability standard for automotive electronic components. 

 

SEMICONDUCTOR ENCAPSULATION MATERIAL MARKET RECENT DEVELOPMENT AND INNOVATION

 

S NoCompany NameDevelopment
1PanasonicA granular semiconductor encapsulating material developed specifically for fan-out wafer-level packages (FOWLP) and panel level packaging (PLP) has been made commercially available, according to Panasonic Corporation. These innovative new solutions will lower the manufacturing costs and boost productivity of these cutting-edge semiconductor packages for wearable and mobile devices.

 

In Panasonic,More functionality is being incorporated into smaller form-factor goods by electronic designers and producers. As a result of this trend, semiconductor packaging methods have been developed and are being widely used to produce packages with a smaller footprint and lower profile. 

 

Due to the enormous number of semiconductors that can be contained in each molded panel, PLP promises a significant reduction in costs. These semiconductor packages' encapsulation materials must display great adherence to the other structures in the package and must uniformly encapsulate large-area formats like wafers and panels without warping. These demands are met by the recently released granular epoxy mold compounds.

 

SEMICONDUCTOR ENCAPSULATION MATERIAL MARKET MARKET DYNAMICS

 

Encapsulation materials are in demand due to the growing popularity of electronic devices like smartphones, tablets, and wearables. This expansion in the semiconductor market is also fueling the demand for these materials.

 

In addition, it is believed that the quick development of technology, such as 5G networks, the Internet of Things (IoT), and artificial intelligence (AI), would further fuel the demand for semiconductor devices and raise the demand for encapsulating resins. 

 

The demand for smaller and more compact semiconductor devices is also increasing as a result of the miniaturization trend that the electronics industry is experiencing, necessitating effective encapsulating materials with excellent thermal stability and performance.

 

The development of new and enhanced resin formulations that offer these qualities is likely to promote market growth. The market for semiconductor encapsulation resin is also expanding as a result of the growing emphasis on renewable energy sources and the rising popularity of electric vehicles (EVs).

 

The encapsulating materials provide protection against severe conditions, enhancing the reliability and durability of the devices. These industries use semiconductor devices for power electronics.

 

Encapsulation enhances assembly handling and shields the delicate semiconductor die, bond wires, and lead frame from outside influences including shock, moisture, and contamination. Epoxy material molding compounds are the most often used packaging materials.

 

These are made up of the titular epoxy resin, inorganic fillers like fused or crystalline silica, and additives that enhance workability during molding and enhance the qualities of the end product.

 

 Hardeners, accelerators, flexibleness, pigments, flame-retardants, coupling agents, releasing agents, and flame-retardants are a few examples of often used additives.

 

Because the packaging material comes into touch with the semiconductor die and bond wires, its qualities have a direct bearing on dependability. Care must be taken when selecting a packaging material to prevent device failure due to warpage, layering, cracking, or corrosion brought on by moisture penetration.

 

Semiconductor manufacturers often purchase molding compounds from specialized outside suppliers, who offer a variety of compound types with tailored compositions for particular products. Chip manufacturers need extensive methods for quality assurance because only the supplier is aware of the precise composition.

 

 

THIS SEMICONDUCTOR ENCAPSULATION MATERIAL MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

  1. How manysemiconductor encapsulation materialare manufactured per annum globally? Who are the sub-component suppliers in different regions?
  2. Cost breakup of a Globalsemiconductor encapsulation materialand key vendor selection criteria
  3. Where is thesemiconductor encapsulation materialmanufactured? What is the average margin per unit?
  4. Market share of Globalsemiconductor encapsulation materialmarket manufacturers and their upcoming products
  5. Cost advantage for OEMs who manufacture Globalsemiconductor encapsulation materialin-house
  6. key predictions for next 5 years in Globalsemiconductor encapsulation materialmarket
  7. Average B-2-Bsemiconductor encapsulation materialmarket price in all segments
  8. Latest trends insemiconductor encapsulation materialmarket, by every market segment
  9. The market size (both volume and value) of thesemiconductor encapsulation materialmarket in 2024-2030 and every year in between?
  10. Production breakup ofsemiconductor encapsulation materialmarket, by suppliers and their OEM relationship
Sl noTopic
1Market Segmentation
2Scope of the report
3Abbreviations
4Research Methodology
5Executive Summary
6Introduction
7Insights from Industry stakeholders
8Cost breakdown of Product by sub-components and average profit margin
9Disruptive innovation in the Industry
10Technology trends in the Industry
11Consumer trends in the industry
12Recent Production Milestones
13Component Manufacturing in US, EU and China
14COVID-19 impact on overall market
15COVID-19 impact on Production of components
16COVID-19 impact on Point of sale
17Market Segmentation, Dynamics and Forecast by Geography, 2024-2030
18Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030
19Market Segmentation, Dynamics and Forecast by Application, 2024-2030
20Market Segmentation, Dynamics and Forecast by End use, 2024-2030
21Product installation rate by OEM, 2023
22Incline/Decline in Average B-2-B selling price in past 5 years
23Competition from substitute products
24Gross margin and average profitability of suppliers
25New product development in past 12 months
26M&A in past 12 months
27Growth strategy of leading players
28Market share of vendors, 2023
29Company Profiles
30Unmet needs and opportunity for new suppliers
31Conclusion
32Appendix