By submitting this form, you are agreeing to the Terms of Use and Privacy Policy.
.
It is a liquid epoxy material with only one component that was developed from semiconductor devices specifically for use in underfill applications. Molded semiconductor devices are resistant to moisture and have excellent electrical properties. Additionally, it has demonstrated remarkable stress reduction through a particular silicone technique.
Epoxy molding compounds and liquid encapsulants are typically two sides of the same coin. They are a mixture of polymeric resin, a hardener, and some fillers that sets at room temperature. They can be liquid or solid (pellets or powder).
When choosing your semiconductor encapsulation method, they differ in a few ways despite their many functional similarities. Additionally, the majority of these distinctions are operational and practical. Disposable liquid encapsulants are best for flexible lab-scale projects that require constant alignment and change.
For flexible projects with lower throughput, they are utilizing a simple and inexpensive dispensing system. This liquid encapsulation that encourages innovation is definitely favored by advanced packaging and research and development. Although the material itself is slightly more expensive (kg to kg), the initial investment is low and it can be used for multiple projects.
In addition, liquid encapsulants can produce packages that are flatter and thinner and can cure at much lower temperatures, making it possible to use delicate components.
If you stack multiple dams, your maximum height is approximately 1 mm. Together with their minimal wire sweep, all of these features propel them toward miniaturization and make them the future encapsulation materials.
The Global semiconductor Liquid Epoxy Encapsulant Material market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Shin-Etsu Chemical’s liquid epoxy encapsulating material (SMC series) is a one-component liquid epoxy material made specifically for underfill applications from semiconductor devices. The electrical properties of “SMC”-molded semiconductor devices are excellent, as is their resistance to moisture.
It is capable of low temperature form molding (125°C), delivers low reflection in large surface area molds with low stress design, High reliability, High purity, Low line Main Applications, Fan-Out Wafer Level Package (FO-WLP, Over Molding for Chip on Wafer Process of 2.5D and 3D Packages), and liquid at room temperature and able to be dispensed, making it suitable for clean room environments.
Other significant characteristics of the company include a flat tip, fast penetration speed even in narrow gaps, no flow marks after curing, high heat, moisture, and wet reflow resistance, high purity, and low line thickness.
