SEMICONDUCTOR PACKAGE SUBSTRATE MATERIALS MARKET

INTRODUCTION

In order to ensure an electrical connection for chip mounting on printed circuit boards, semiconductor packaging materials are crucial in shielding IC chips from the outside environment.

Due to the rapid advancement of electronics technology, including artificial intelligence (AI), cloud computing, and the intelligentization of automobiles, as well as the miniaturisation and thinning of electronic devices, exemplified by smartphones and wearable technology, semiconductor packages are further required to be high density, multilayer, and low-profile.  

SEMICONDUCTOR PACKAGE SUBSTRATE MATERIALS MARKET SIZE AND FORECAST

 The Global Semiconductor package substrate materials market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

SEMICONDUCTOR PACKAGE SUBSTRATE MATERIALS MARKET NEW PRODUCT LAUNCH

The world's thinnest semiconductor package substrate has been launched by LG Innotek. The semiconductor package substrate known as COF (Chip on Film) joins the main printed circuit board and the display.

In electronic products like televisions, laptops, monitors, and smartphones, it aids in reducing display bezels and miniaturising modules.

t is also known as an ultra-fine flexible circuit board, which can replace the current flexible printed circuit board (FPCB), because microcircuits must be produced on very thin sheets, requiring a high level of technology.

 COF can only generate circuits on one side of the film, but "2-Metal COF" is able to do so on both sides of the film, forming a huge number of fine circuits that enable electrical signals to move between devices more quickly and support its high-definition processing screen image.

The device features a 25 mm through hole size, according to LG Innotek. The through hole is around one-fourth of a human hair's thickness, which is 100 m for each individual hair. 

The more channels between the product's upper and bottom surfaces and graphic circuits there are, the smaller the via hole must be for an electrical signal to flow through them all.

As the metaverse era has officially begun, there has been a recent increase in demand for bendable or foldable displays as well as for flexible components mounted on them. For this reason, "2-Metal COF" that can be bent freely is one of the products that fits the current display industry trend.

SEMICONDUCTOR PACKAGE SUBSTRATE MATERIALS MARKET COMPANY PROFILES

• Ibiden
• Kinsus
• Shinko
• Kyocera Corporation
• Simmtech
• Daeduck

THIS SEMICONDUCTOR PACKAGE SUBSTRATE MATERIALS MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Semiconductor package substrate materials are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Semiconductor package substrate materials and key vendor selection criteria
3. Where is the Semiconductor package substrate materials manufactured? What is the average margin per unit?
4. Market share of Global Semiconductor package substrate materials market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Semiconductor package substrate materials in-house
6. key predictions for next 5 years in Global Semiconductor package substrate materials market
7. Average B-2-B Semiconductor package substrate materials market price in all segments
8. Latest trends in Semiconductor package substrate materials market, by every market segment
9. The market size (both volume and value) of the Semiconductor package substrate materials market in 2024-2030 and every year in between?
10. Production breakup of Semiconductor package substrate materials market, by suppliers and their OEM relationship