
- Get in Touch with Us
Last Updated: Apr 25, 2025 | Study Period: 2022-2030
SerDes is a functional block used in high-speed chip-to-chip communication that serialises and deserializes digital data.
Modern SoCs incorporate SerDes that can support several data speeds and standards like PCI Express (PCIe), MIPI, Ethernet, USB, USR/XSR in order to support applications for high-performance computing (HPC), artificial intelligence (AI), automotive, mobile, and Internet of Things (IoT).
Impedance matching hardware, clock data recovery capabilities, and parallel-to-serial (or serial-to-parallel) data conversion are all included in a SerDes implementation. SerDes' main function is to reduce the amount of I/O interconnects.
High speed data transport across the ICs is necessary for distributed data processing in ICs. There are two ways to send data between chips: parallel and serial. In contrast to serial data transfer, which only needs one pair of connections, parallel data transfer requires several connections between ICs.
The Global SerDes IC market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
The Power Management IC (PMIC) (BD86852MUF-C) and new SerDes ICs (BU18xMxx-C series*) from ROHM Semiconductor are perfect for vehicle satellite camera modules for Advanced Driver Assistance Systems (ADAS).
The new products not only address concerns with module shrinking and low power consumption, but they also provide low electromagnetic noise (EMI) qualities that speed up development.
Applications for ADAS use a combination of hardware that use several distance-measuring techniques, including LiDAR, radar, sonar, and cameras. Among these, cameras are crucial for spotting objects and hazardous conditions around the car. The most recent vehicles come with 10 cameras or more.
By merging SerDes ICs with a new PMIC for cameras, ROHM overcomes these difficulties. Spread spectrum technology is used by both items to lessen EMI. This also makes EMI countermeasures easier to implement, which can take up a lot of time when designing automotive applications.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
21 | Product installation rate by OEM, 2022 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2022 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |