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Last Updated: Apr 26, 2025 | Study Period: 2020-2030
SiC means Schotty barrier diodes and SBD means Si schottky barrier diodes . Fast functioning is a key feature, and the structure is virtually identical to that of a Si Schottky barrier diode. SiC SBDs have a high voltage and good high-speed functioning as its main characteristics.

PN-junction diodes are Si diodes with breakdown voltages comparable to or greater than that of SBDs . In an SBD, only moving electrons are responsible for current flow, whereas in a PN-junction diode, both moving electrons and moving holes are responsible. The minority carrier, or holes, build up in the n layer, which causes the resistance value to decrease. This results in the simultaneous achievement of a high withstand voltage and low resistance, but the turn-off time is slow.
The global SiC SBD market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Announcing the release of its 2nd-generation discrete SiC-SBD Series of power semiconductors, Fuji Electric Co., Ltd. is happy to help data centers and communication base stations save energy.
Making a thinner substrate element is one method of reducing power loss in power semiconductors by shortening the distance that the energy travels. This series makes use of a SiC (silicon carbide) substrate that is around one-third thinner than FE's customary 1st-generation SiC-SBD Series and a redesigned chip structure that successfully lowers steady-state loss. FE has used its unique processing method to produce one of the thinnest substrates in the industry. Additionally, it has increased resilience to strong currents.
The silicon-carbide Schottky-barrier diode (SiC-SBD), which minimizes the power loss and physical size of power supply systems for infrastructure, photovoltaic power systems, and more, was introduced by Mitsubishi Electric Corporation.
Due to the junction-barrier Schottky (JBS) structure, this product's silicon carbide helps to reduce power loss and package space. It also expands the product line's suitability for a variety of applications.
COMPANY PROFILE
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
| 21 | Product installation rate by OEM, 2022 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2022 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |