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Last Updated: Apr 25, 2025 | Study Period: 2023-2030
Atmospheric Pressure Chemical Vapour Deposition is what the name "APCVD" refers to. It is a procedure used to deposit thin films of different materials onto silicon wafers during the production of semiconductors. A "Silicon APCVD System" is a particular category of APCVD system created specifically for the purpose of depositing silicon films in the context of your query.
The deposition process in APCVD occurs at atmospheric pressure, not in a vacuum but rather under normal atmospheric circumstances. In comparison to other deposition techniques like Low-Pressure Chemical Vapour Deposition (LPCVD) or Plasma-Enhanced Chemical Vapour Deposition (PECVD), APCVD systems are therefore more affordable and simpler to use.
A reaction chamber is often the main component of a silicon APCVD system, where the deposition process takes place. For the deposition of silicon films, the chamber is built to maintain the desired temperature and ambient conditions.
Along with heating components or a furnace to provide the appropriate temperature for the deposition process, the system also comprises a gas delivery system to bring the required precursor gases into the chamber.
The silicon films created by APCVD can be used for a variety of processes in the production of semiconductors. They can serve as diffusion sources for doping operations, passivation layers to shield the underlying structures, or seed layers for subsequent deposition procedures.
By modifying the deposition parameters, such as temperature, gas flow rates, and precursor gases, the specific features and traits of the silicon films can be changed.
An integrated circuit and other semiconductor devices can be created using a silicon APCVD system, which is a technique used in the semiconductor industry to deposit silicon films onto silicon wafers.
TheGlobal Silicon APCVD System Marketaccounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
A prominent supplier of chemical vapor deposition systems, CVD Equipment Corporation , declared that it has received a second order for ten (10) high-performance PVT-150 systems.
The equipment will be used to grow monocrystalline silicon carbide (SiC) boules that are 150 mm in diameter. These boules are then processed into SiC wafers, which are used in power electronics.
SiC power circuits enable faster charging times and improved performance due to their superior power density and efficiency compared to their silicon-based predecessors. SiC is becoming more popular due to its reputation as a more effective substitute for silicon in the automobile industry. SiC's use in electric vehicle inverters enables higher efficiency, longer range, and/or smaller batteries.
SiC is another material used in charging infrastructures that enables higher performance and faster charging, which has been a growing trend in the electric vehicle sector.
Physical Vapour Transport (PVT) is the main manufacturing process used to develop SiC boules for wafer fabrication as the demand for SiC devices for high-power electronics for electric vehicles, energy, and industrial applications keeps rising.
In order to facilitate the manufacture of high-quality SiC boules for high-yield SiC wafers, CVD Equipment has precisely built PVT systems. We are dedicated to addressing the industry's crucial high-volume production needs and further supporting the evolution to systems of 200 mm and above. We now provide crystal growing systems that are 150 mm in diameter.
Self-cleaning belt conveyors provide the lowest CoO for dielectric gap-filling, resulting in exceptional system reliability.In accordance with a contract with SPP Technologies, Ltd., SPTS provides Atmospheric Pressure CVD of SiH4 or TEOS-based dielectrics solutions. With no transitory film characteristics and homogeneous gap filling across the wafer, this APCVD product line based on proprietary Watkins Johnson (WJ) linear injector technology provides precise, repeatable deposition of doped or undoped films. A self-cleaning belt conveyor is used to carry wafers, resulting in outstanding system dependability and the lowest CoO for dielectric gap-fill.
Accessible platforms with a variety of possibilitiesFor TEOS and hydride operations, the WJ-999 has three process chambers.4 process chambers for the TEOS and hydride processes in the WJ-1000WJ-1500 - 4 chambers exclusively for TEOS procedures.
All systems can be factory-certified for system remanufacturing, and a variety of upgrade options guarantee the product's durability and extensibility.
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2023-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2023-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2023-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |