- Get in Touch with Us
Last Updated: Apr 25, 2025 | Study Period: 2024-2030
A cutting-edge development in semiconductor technology, Silicon Carbide (Sic) MOSFETs promise unmatched performance and efficiency. Sic is a compound semiconductor that boasts amazing qualities like excellent electron mobility, wide bandgap, and good thermal conductivity.
Compared to conventional silicon-based MOSFETs, Sic MOSFETs have lower power losses and improved energy efficiency because of their ability to operate at higher temperatures and voltages. Sic MOSFETs have the potential to revolutionize industries by improving power conversion efficiency and overall system reliability in a variety of applications, from electric automobiles to power electronics.
Sic MOSFETs are set to drive innovation and change the face of effective and sustainable technological solutions as we embrace the future of semiconductor devices.
A semiconductor called silicon carbide is being used in a larger number of electronics products. Silicon carbide MOSFETs are a fine example of such devices.
The blocking voltage, on-state resistance, and thermal conductivity of Silicon Carbide (Sic) MOSFETs are higher than those of silicon. Sic MOSFETs are created and processed much in the same manner as silicon MOSFETs.
Sic MOSFETs are widely used in numerous power applications where they offer a much higher level of performance.
The Global Silicon carbide (Sic) MOSFET market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The first fully-qualified commercial silicon carbide power MOSFET, according to Cree, Inc., has been introduced. With an on-state resistance (RD Son) of only 80m at 25°C, Cree's Sic MOSFET, the CMF20120D, offers blocking voltages up to 1200V. The RD Son stays below 100m over the entire operating temperature range of Cree's Sic MOSFET, setting it apart from comparable silicon devices.
Five 650V silicon carbide (Sic) MOSFET transistors have been released by Toshiba for use in industrial equipment. The sophisticated third generation Sic technology, which optimizes the cell architectures utilized in second-generation devices, is the foundation for the new TW015N65C, TW027N65C, TW048N65C, TW083N65C, and TW107N65C.
New complete silicon carbide MOSFET module options for recharging electric vehicles have been announced by ON Semiconductor.
Sic technology has been a focus of ROHM Semiconductor, which also provides Sic MOSFETs to meet the demands of diverse industries for power control. Their Sic MOSFETs are made to withstand high-frequency switching and high-temperature conditions, making it possible to create more effective and small power electronics systems.
STMicroelectronics has been advancing Sic technology, including Sic MOSFETs, to meet the demands of industries like automotive and industrial automation. Their Sic MOSFETs are designed to handle high-voltage and high-temperature conditions, making them suitable for applications where traditional silicon devices would struggle.
Microchip Technology offers a range of Sic MOSFETs for power electronics applications such as motor drives, solar inverters, and more. Their Sic MOSFETs are designed to provide improved switching efficiency and better thermal performance compared to traditional silicon MOSFETs.
| S No | Product Name | Development |
| 1 | Cool Sic MOSFET | Cool Sic MOSFET power modules from Infineon give inverter designers new ways to achieve previously unheard-of levels of efficiency and power density. |
| 2 | N-series of 1200V Sic-MOSFETs | The N-series of 1200V Sic-MOSFETs in a TO-247-4 package, introduced by Mitsubishi Electric Corporation, are a new series of silicon-carbide metal-oxide semiconductor field-effect transistors (MOSFETs) with lower switching loss than the TO-247-3 packaging devices already available. |
The overallCool Sic MOSFETefficiency is increased when Silicon Carbide (Sic) semiconductors are employed as switches because they support higher switching frequencies and operating temperatures.
Furthermore, Silicon Carbide (Sic) power modules come in a variety of topologies and can be customized for various application requirements.The variety of Cool Sic Silicon Carbide MOSFET power modules come in a variety of configurations, including 3-level, half-bridge, four-pack, six-pack, and booster.
The Sic MOSFET modules provide the best-in-class switching and conduction losses, best-in-class gate-oxide reliability, and state-of-the-art trench design.All Easy PACK, Easy DUAL, and Cool Sic MOSFET power modules can be bought with Thermal Interface Material (TIM) already applied, and further features can also be added.
The new series, N-series of 1200V Sic-MOSFETs will aid in lowering the physical size and power consumption of high-voltage conversion-required power-supply systems, such as photovoltaic power systems and on-board chargers for electric vehicles (EVs).
Unlike traditional 3-pin packages, the newly introduced driver divides the driver-source-terminal from the power source terminal.The new launch's four-pin package reduces the physical size and power consumption of power supply systems.
Sic-MOSFET chip with good merit and high self-turn-on tolerance is mounted on TO-247-4 packaging, which has both a traditional 3-pin package and an independent driver source terminal.
Reduces parasitic inductance, a difficulty in high-speed switching, by using a four-pin package. Comparing TO-247-3 devices to other products, switching loss can be reduced by eliminating gate-source voltage decreases brought on by current changes.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
© 2017-2025 Mobility Foresights Admin Pvt Ltd. All rights reserved.