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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
An electronic component's foundation material, silicon wafers are thin, disc-shaped slices of silicon crystal that are used to make integrated circuits (ICs) and other semiconductor devices. The basic building blocks of today's semiconductor industry are silicon wafers.
The following are some essential features of silicon wafers:
Structure of silicon crystals: Chemical element silicon has the chemical symbol Si and atomic number 14. It is a member of the periodic table's Group IV, or semiconductor, group of elements. Each silicon atom is connected to four other silicon atoms in a tetrahedral arrangement, giving silicon its crystalline structure.
Wafer manufacturing: Czochralski (CZ) growth is a common method used to create silicon wafers. A microscopic silicon seed crystal is progressively dragged upward using this method after being dipped into a molten silicon melt. The liquid silicon hardens as the crystal is pulled, forming a cylindrical ingot. After that, using specialized cutting tools, the ingot is chopped into tiny wafers.
Dopants and purity: The performance of silicon wafers in electronic devices depends on their purity. Impurity levels are decreased to incredibly low concentrations when high-purity silicon wafers are created. However, during the production process, specific amounts of impurities known as dopants are purposefully added to the silicon crystal in order to control the material's electrical properties. Boron, phosphorus, arsenic, and antimony are typical dopants.
Wafer technical details: There are several different sizes of silicon wafers available; these sizes are typically expressed in inches (for example, 4, 6, 8, and 12 inches). The number of ICs that may be produced concurrently on a single wafer depends on the wafer's size, which has an impact on manufacturing efficiency. Wafer thicknesses can also differ; typical ranges are between 200 and 1000 micrometers.
Silicon wafers must meet specified specifications for their surface quality and flatness. Even little flaws can have an impact on how well the electrical components constructed on the wafer work, so the wafer surface must be flawless and free of faults. The wafer's flatness guarantees consistency throughout production procedures like photolithography and deposition.
The distinct characteristics of silicon wafer material, such as its abundance, semiconducting nature, and manufacturability, make it a suitable substrate for the manufacture of electronic components. The silicon wafers serve as the building blocks for the production of transistors, diodes, memory cells, and other crucial semiconductor devices that power today's electronics through complex fabrication processes.
The Global Silicon Wafer Material Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
GlobalFoundries, a leader in the production of semiconductors with advanced features, and Qualcomm Technologies, Inc. announced that they are expanding their previous strategic global long-term semiconductor manufacturing agreement by more than twofold.
With today's announcement, GF's most cutting-edge semiconductor production facility in Malta, New York, will be able to expand its capacity and support U.S.-based manufacturing by securing wafer supply.
In addition to National Economic Council Director Brian Deese, Under Secretary of Defense for Acquisition & Sustainability Dr. William LaPlante, and National Security Council Senior Director for Technology & National Security Tarun Chhabra, the announcement was made in Washington, D.C., at a CEO Summit co-hosted by GF, Ford Motor Company, and Applied Materials.