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When connecting components on a printed circuit board, the electronics industry often uses silver sinter paste as a conductive substance .
It is often screen printed onto the surface of a PCB to create patterns that act as electrical connections. It is a suspension of small silver particles in a carrier fluid.
The silver particles in the paste are then sintered together during a high-temperature firing to create a solid, highly conductive link.
Silver sintering or silver bumping are two terms used to describe this procedure. Applications that call for high electrical conductivity, like power electronics, LED lighting, and automobile electronics, frequently use silver sinter paste.
The Silver Sinter Paste accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
In contrast to high-lead solders, the new, ecologically friendly XT2773R7 Silver Sinter Paste from Kyocera Corporation is now available in Europe.
This product was developed using a patented formula. The lead-free, pressure-free Silver Sinter Paste from Kyocera performs admirably in terms of heat transfer and electrical performance, as well as adhering to bare copper with an incredible amount of force.
The Silver Sinter Paste from Kyocera, which is based on nano-silver technology, has thermal conductivity of more than 200 W/mK.
The thermal conductivity of Kyocera’s Silver Sinter Paste is more than three times greater than that of conventional solders and electrically conductive die-attach pastes.
Heraeus has created a brand-new idea for silver sinter pastes. In the novel idea, sinter additives and tiny scale silver particles are used. The innovative pastes can be employed in pressure-free or low-pressure bonding processes and have a high sinter activity.
In order to increase efficiency and reliability during the power module assembly process, DuPont launched a cutting-edge screen printable sinter silver solution.
The product, DuPont DA510, is a cutting-edge pressure sintering silver paste that offers superior sintered density, good thermal and electrical conductivity, and a quick turn-around time.
The construction of high performance and high-density power modules for the automotive power electronics industry segment is made possible by the accompanying thermal cycle reliability.
Wide band semiconductor MOSFET chips can now be used in the rapidly expanding vehicle electrification sector and other applications thanks to the new sintered silver from DuPont Microcircuit Materials.
