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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
These systems frequently carry out highly repeatable tasks needing high degrees of precision. For oxide and nitride depositions, single-wafer PECVD systems are more frequently used, but batch systems are also available.
Deposition is a fabrication method whereby materials are applied to a wafer in thin sheets. A microsystem is created by depositing many layers of various materials. Every material and layer has a specific purpose.
A wafer, also known as a slice or substrate, is a thin semiconductor slice used in electronics to make solar cells and integrated circuits. It is often made of crystalline silicon (c-Si). Microelectronic devices are constructed in and upon the wafer, which acts as the substrate for those devices.
Deposition is a technique that covers a surface with a layer of materials. Selective deposition, atomic-layer deposition, chemical vapour deposition, and physical vapour deposition are a few methods that can be used to accomplish this.
The global Single Wafer Deposition System market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Tokyo Electron (TEL) announced today that the Triase+EX-II Pro single-wafer metallization system will soon go on sale.
A high-speed single-wafer ASD1 system called the Triase+ EX-II Pro can deposit films made of titanium nitride (TiN) and titanium silicon nitride (TiSiN). The soon-to-be-released Triase+ EX-II Pro has been created to meet the technological requirements of advanced devices that feature increasingly complex structures and multilayered design, building on the existing Triase+ EX-II TiN series that have been used in the interconnect and electrode metallization processes for memory and logic devices.
Numerous benefits come with the Triase+ EX-II Pro, such as outstanding step coverage for high aspect ratio structures, continuity of ultra-thin films, consistency of film thickness, increased productivity over earlier models, and process compliance with different temperature zones.
The Triase+ EX-II Pro has a gas delivery system that allows for high-volume gas flow with high purge efficiency2 as well as a heat controlling system to support these capabilities. Existing customers can upgrade to the most recent hardware at a lower cost by retrofitting earlier models with these new features.
According to, Vice President & General Manager, TFF BU at TEL, "The Triase+ EX-II Pro delivers a technology solution that meets the latest device scaling needs. They will keep responding to even more difficult problems of the future by enhancing technology development and expanding their product line.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |