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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
This plasma system makes it possible to use specific plasma sources and enter applications with greater criteria. Hand-loaded substrates range in size from a single wafer up to 300 mm in diameter to tiny batches of smaller wafers.
Plasma cleaning is frequently used in semiconductor production to prepare a wafer surface for wire bonding. Removing pollution (flux) improves the bond's adhesion, extending the durability and dependability of the device.
Any plasma therapy carried out when oxygen is added to the plasma chamber is referred to as oxygen plasma. Surfaces are frequently cleaned with oxygen before bonding. It can also be used in conjunction with other gases to etch a number of materials, including rubber and plastic.
Plasma etching is the process of removing plastic, silicon, or other non-metallic materials by ionising a gasâtypically oxygen and CF4âand creating plasma as a result. Without the use of chemical etchants, the excited ions collide with the material at the atomic level and remove it.
By rupturing molecular bonds and adding hydroxyl groups, plasma cleaning can also make the surface of the treated object hydrophilic.
The patterned PDMS (dimethylpolysiloxane) surface is additionally given hydrophilicity during the semiconductor manufacturing process to enhance pattern adhesion.
By introducing chemical functional groups, plasma cleaning eliminates organic impurities and makes surfaces ready for further processing. Benchtop plasma cleaners quickly and easily adjust surface chemistry without using risky wet chemicals.
The Global Single Wafer Plasma Treatment System market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
In the GIGAfab product line, the plasma systems for single-wafer operation are combined. Depending on the substrate type or the customer's application requirements, these systems are offered in a variety of configurations, ranging from the manually loaded system to the completely automatic version.
These systems can be configured with a variety of plasma sources, depending on the application: from straightforward microwave sources that are economical and large-scale sources to radical sources with a distant plasma for temperature-sensitive silicon etching operations for thinner wafers. Here, a variety of concepts can be used to temper the wafer.
The wafers are placed on the heating or cooling plant located on the door in the manually loaded systems, which include a pull-out door for the chamber. In the automatic systems, on-the-fly alignment is used to load the wafers into the chamber with a robot system.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |