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SIP refers to the high level integration of several parts, dies, and chips in a single package to accomplish multiple functions in a single system. As a common assembly medium, solder paste serves as a link between the components, dies, and chips and the substrate to create a single package.
One package has a lot of varied-sized components, die, and chips; as a result, the assembly of the entire package requires several separate application processes.
In order to attach passive components, attach dies, and flip chips all at once in SiP by printing, a novel water soluble solder paste with good printing performance was developed.
To increase the production yield in System in Package, a solder paste’s printing performance is crucial (SiP). Minimising voids in solder joints is essential to increase the reliability of the entire assembly since they have an impact on the device’s thermal conductivity and electrical conductivity.
This study work also looked at how to reduce void, notably with flip chips and larger die sizes, by modifying the reflow profile and adding vacuum during reflow.
To reduce bridging in such designs, solder paste with minimum slump behavior will be needed. Other crucial characteristics of solder paste for SiP assembly include consistency in solder paste printing transfer efficiency, stencil life, good wetting, grabbing resistance, and low voiding.
As a result, assemblies with smaller components and higher density are produced by pushing miniaturisation to even greater levels.
System in Package (SiP) technology assembles numerous semiconductor chips and numerous passive components into a tiny module to enable more functionality in a smaller area. Assembling such SiPs requires intricate and lengthy stages, which presents a problem for production.
The Global SiP solder paste market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
A new jetting solder paste has been added to the PicoShot product range, according to Indium Corporation. Customers that require SnPb solder paste for their Mycronic MY-series jet printers can use the PicoShot WS-5M. A water-soluble, halogen-free paste called PicoShot WS-5M was created in close cooperation with Mycronic for their MY 600/700 jetting systems.
This product has undergone beta testing at client locations and has demonstrated performance on client lines. A water-soluble, halogen-free solder paste called PicoShot WS-5M has been approved following joint technological development between Indium and Mycronic using Mycronic’s jetting technology.
Military and aerospace applications, CSP/microBGA solder attach, system-in-package (SiP), camera module assembly where an overmolding step is necessary, shield-attach, and secondary processing are just a few of the uses for PicoShot.
It can also be used for jetting into cavities and uneven or warped substrates, high-mix/low-volume stencil replacement, and military and aerospace applications.
