GLOBAL SLICED WAFER DEMOUNTING AND CLEANING MACHINE MARKET

INTRODUCTION

 An ingot is cleaned after being cut with this multipurpose cleaning device, which also demounts each wafer from the base plate, cleans each wafer after demounting, and saves the wafers in a cassette.

A number of materials can be used with it.The operating costs are cheap. Oil slurry or water-soluble slurry can be used with the equipment, and a filter allows the cleaning water to be reused. Every wire-saw manufacturer's base plate is built to fit the loader, and each wire-ingot saw's lifter can be used to load an ingot into the machine.

GLOBAL SLICED WAFER DEMOUNTING AND CLEANING MACHINE MARKET SIZE AND FORECAST

The Global Sliced Wafer Demounting and Cleaning Machine market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

RECENT INVENTION

The present invention provides a safe and straightforward method for protecting a plurality of wafers, such as silicon semiconductor wafers, and more specifically a wafer on the topmost layer of a wafer stack in which a semiconductor wafer for solar cells is stacked from a lower wafer that is adjacent to it.

a new wafer demount technique, a reliable wafer demount tool, and a wafer demount conveyor that uses the wafer demount tool. A device has been developed for wafer demounting where a fluid is blown in between, and the wafer of the top layer is gradually elevated to demount the wafer.

A wafer demounting technique for removing a wafer from the top layer of a wafer stack made up of several sheets or wafers, where the angle is tilted 15° to 75° either clockwise or counterclockwise from the top wafer's wall axis In order to press the wafer of the uppermost layer in the axial direction and create the bending stress of the wafer of the uppermost layer in the axial direction, the lower side of the wafer of the uppermost layer that is next to the lower surface of the wafer of the uppermost layer is bent while the upper edge of the wafer of the uppermost layer is bent upward. A technique for demounting wafers involves blowing a fluid between a wafer's upper surface.

COMPANY PROFILE

• Modutek
• Dataintelo
• Tierra Tech
• Tencor Corporation
• Atecom Technology

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Sliced Wafer Demounting and Cleaning Machines are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Sliced Wafer Demounting and Cleaning Machine and key vendor selection criteria
3. Where is the Sliced Wafer Demounting and Cleaning Machine manufactured? What is the average margin per unit?
4. Market share of Global Sliced Wafer Demounting and Cleaning Machine market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Sliced Wafer Demounting and Cleaning Machine in-house
6. key predictions for next 5 years in Global Sliced Wafer Demounting and Cleaning Machine market
7. Average B-2-B Sliced Wafer Demounting and Cleaning Machine market price in all segments
8. Latest trends in Sliced Wafer Demounting and Cleaning Machine market, by every market segment
9. The market size (both volume and value) of the Sliced Wafer Demounting and Cleaning Machine market in 2023-2030 and every year in between?
10. Production breakup of Sliced Wafer Demounting and Cleaning Machine market, by suppliers and their OEM relationship