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The sensor can be used to detect gestures, head and eye tracking, depth and motion detection, and simultaneous localization and mapping (SLAM).
The charge-coupled device (CCD) and the active-pixel sensor (CMOS sensor) are the two primary types of electronic image sensors.
Metal–oxide–semiconductor (MOS) technology is the foundation of both CCD and CMOS sensors; MOS capacitors are used in CCDs, whereas MOSFET (MOS field-effect transistor) amplifiers are used in CMOS sensors.
The most well known picture sensor is the reciprocal metal oxide semiconductor (CMOS) picture sensor as it is less expensive, more modest, and consumes less power than charge-coupled gadget (CCD) picture sensor. CCD image sensors, on the other hand, provide an image of excellent quality with low noise.
The Global small-form factor image sensor market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
The ADCC-3100 is a one-fifth-inch optical-format, 1.3-megapixel SFF CMOS image sensor from Avago Technologies that features advanced image processing features like spot metering.
Avago’s entrance into the arising SFF item classification targets changing prerequisites in the PDA market. OEMs and camera module assemblers (CMAs) can upgrade VGA camera phones with SFF CMOS sensors or create desirable ultra-thin camera phones.
Similar to digital-still cameras, camera phones have developed in the following manner: specifically, a race toward higher goal with assumptions for development in picture quality.
In a handset environment, higher resolution comes with its own set of challenges, including increased complexity, increased cost (such as memory, data bus, lens, and packaging), and limitations in size.
The ADCC-3100 Small Form Factor sensor was created by Avago to meet the demand for higher image quality in a smaller package with the same resolution.
By enabling a thinner phone design and capturing more light with fewer pixels, Avago’s ADCC-3100 addresses the technical difficulties of SFF.
In addition to reducing system processing overhead, design complexity, and time to market, on-chip image processing also eliminates the requirement for an additional companion chip that consumes power and occupies a lot of space.
The ADCC-3100 fits easily into a low-profile camera module that measures 6.0 mm x 6.0 mm x 4.5 mm and is smaller than the eraser tip on a pencil.
