SMALL OUTLINE INTEGRATED CIRCUIT (SOIC) PACKAGING MARKET
INTRODUCTION TO SMALL OUTLINE INTEGRATED CIRCUIT (SOIC) PACKAGING MARKET
Surface-mount packaging for integrated circuits is known as Small Outline Integrated Circuit (SOIC) packaging (ICs). It is made to be lighter and smaller than other types of packaging, which makes it perfect for usage in applications where space is limited.
Pin pitch (the space between pins) for SOIC packages ranges from 8 to 24 pins and is either 0.65 mm or 1.27 mm. The IC is housed in a rectangular box with leads protruding from two of its sides. In order to solder the leads directly to a printed circuit board, they are often bent downward at a 90-degree angle (PCB).
Ceramic and plastic are just two of the materials that can be used to create SOIC packaging. It offers good dependability, low cost, and good electrical performance. SOIC packaging is frequently utilised in products including mobile devices, automotive electronics, and consumer electronics because to its tiny size.
SOIC packaging comes in a variety of forms, including: The thinner body of narrow-body SOIC (NS) enables higher board densities than regular SOIC. When compared to SOIC, the shrink small outline package (SSOP) has a smaller body but the same pin spacing. Thin Small Outline Package (TSOP): Compared to SOIC, this has a thinner body, enabling higher board densities.
SMALL OUTLINE INTEGRATED CIRCUIT (SOIC) PACKAGING MARKET SIZE AND FORECAST
Global small outline integrated circuit (SOIC) packaging market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
SMALL OUTLINE INTEGRATED CIRCUIT (SOIC) PACKAGING MARKET NEW PRODUCT LAUNCH
The most recent developments in SOIC packaging technology include 3D stacked packages that are targeted at mobile platforms and use micro-bumped die combined vertically with redistribution layers and TIVs. System-on-integrated chips are a more sophisticated vertical-die stacked 3D topology packaging family. (SoIC).
It uses aggressive pitch direct Cu bonding between the die. TSMC’s SoIC technology offers more than 200X the connection density and 15X the interconnect density in comparison to microbumps.
SMALL OUTLINE INTEGRATED CIRCUIT (SOIC) PACKAGING MARKET COMPANY PROFILE
- NXP Semiconductors
- Microchip Technology
- Maxim Integrated
- Vishay
- ON Semiconductor
- STMicroelectronics
- Texas Instruments
THIS SMALL OUTLINE INTEGRATED CIRCUIT (SOIC) PACKAGING MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS
- How many small outline integrated circuit (SOIC) packaging are manufactured per annum globally? Who are the sub-component suppliers in different regions?
- Cost breakup of a Global small outline integrated circuit (SOIC) packaging and key vendor selection criteria
- Where is the small outline integrated circuit (SOIC) packaging manufactured? What is the average margin per unit?
- Market share of Global small outline integrated circuit (SOIC) packaging market manufacturers and their upcoming products
- Cost advantage for OEMs who manufacture Global small outline integrated circuit (SOIC) packaging in-house
- key predictions for next 5 years in Global small outline integrated circuit (SOIC) packaging market
- Average B-2-B small outline integrated circuit (SOIC) packaging market price in all segments
- Latest trends in small outline integrated circuit (SOIC) packaging market, by every market segment
- The market size (both volume and value) of the small outline integrated circuit (SOIC) packaging market in 2024-2030 and every year in between?
- Production breakup of small outline integrated circuit (SOIC) packaging market, by suppliers and their OEM relationship
