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Surface-mount packaging for integrated circuits is known as Small Outline Integrated Circuit (SOIC) packaging (ICs). It is made to be lighter and smaller than other types of packaging, which makes it perfect for usage in applications where space is limited.
Pin pitch (the space between pins) for SOIC packages ranges from 8 to 24 pins and is either 0.65 mm or 1.27 mm. The IC is housed in a rectangular box with leads protruding from two of its sides. In order to solder the leads directly to a printed circuit board, they are often bent downward at a 90-degree angle (PCB).
Ceramic and plastic are just two of the materials that can be used to create SOIC packaging. It offers good dependability, low cost, and good electrical performance. SOIC packaging is frequently utilised in products including mobile devices, automotive electronics, and consumer electronics because to its tiny size.
SOIC packaging comes in a variety of forms, including: The thinner body of narrow-body SOIC (NS) enables higher board densities than regular SOIC. When compared to SOIC, the shrink small outline package (SSOP) has a smaller body but the same pin spacing. Thin Small Outline Package (TSOP): Compared to SOIC, this has a thinner body, enabling higher board densities.
Global small outline integrated circuit (SOIC) packaging market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The most recent developments in SOIC packaging technology include 3D stacked packages that are targeted at mobile platforms and use micro-bumped die combined vertically with redistribution layers and TIVs. System-on-integrated chips are a more sophisticated vertical-die stacked 3D topology packaging family. (SoIC).
It uses aggressive pitch direct Cu bonding between the die. TSMC’s SoIC technology offers more than 200X the connection density and 15X the interconnect density in comparison to microbumps.
