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In PCB surface-mount assemblies, SMT adhesives are used to secure components to the board during wave soldering or double-sided reflow. In order to prevent component displacement during high speed procedures, glue is employed to affix the Surface-Mount Device (SMD) to the PCB.
To hold the SMD in place throughout the entire soldering procedure, the wet adhesive must have enough “green” strength. The electronics circuit’s ability to operate must not be impacted by the adhesive.
The Global SMT Adhesives market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
For semiconductor and SMT applications, DELO has launched New Die Attach Adhesive. Printed circuit boards frequently incorporate adhesives for electrical insulation in addition to using them to fix components.
In order to satisfy the growing demands for miniaturization, they are typically required to be temperature-resistant and to have good dispensing qualities.
In place of the already available DELOMONOPOX MK096 adhesive, the new die attach adhesive is ideally suited for prolonged use. It is a single-component epoxy resin that cures using heat, just like its predecessor.
After being stored for seven days at 85% relative air humidity and +85 °C, the new glue displays a 150% increase in strength.
The flow characteristics of DELOMONOPOX EG2596 are created to permit dispensing using jet valves and needles. The adhesive offers a variety of application choices due to its flexibility.
Tests carried out jointly by DELO and its technology partner ASM Assembly Methods, a global producer of SMT placement machines and solutions, demonstrate the superior dispensing qualities of the die attach adhesive utilizing, among other dispensing systems, the “Glue Feeder.”
The adhesive can be dispensed contactless Ly and upside down using this jet valve. In order to provide quick and extremely accurate procedures, the glue is applied directly to the particular component rather than the printed circuit board.
Drop sizes as small as 250 m or less may be possible, depending on the dispensing apparatus. The high thixotropy index of DELOMONOPOX EG2596, which is 9., is another benefit. The more flow-resistant the dispensing pattern is after the dispensing procedure, the higher the index value.
Due to the shear in the dispensing valve and the DELOMONOPOX EG2596’s thixotropic qualities, the adhesive can be applied very finely in a low-viscous state.
