GLOBAL SOLAR CELL WAFER SLICING EQUIPMENT MARKET 

INTRODUCTION

The solar PV industry uses a solar cell laser scribing machine to scribe or cut silicon wafers and solar cells, including mono-si (mono crystalline silicon) and poly-si (poly crystalline silicon) silicon wafers.

A thin slice of crystalline silicon (a semiconductor) known as a solar wafer serves as a substrate for microeconomic devices used to create integrated circuits for photovoltaics (PVs), which are used to create solar cells. This also goes by the name silicon wafer.

In order to create the purer, metallurgical-grade silicon that goes into solar panels, silica is heated in the presence of carbon to remove the oxygen. This process is known as reduction.

The grade must then undergo additional purification to produce polysilicon, which has a purity of 99.999 percent for solar use.

GLOBAL SOLAR CELL WAFER SLICING EQUIPMENT MARKET SIZE AND FORECAST

Global solar cell wafer slicing equipment market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

NEW PRODUCT LAUNCH

The German company 3D-Micromac AG, which provides roll-to-roll laser systems and laser micro-machining services, has presented a new laser-cutting technology for the manufacture of solar cells with partial cuts and shingles.

By reducing power losses and ensuring extraordinarily high mechanical strength of cut cells, the new microCELL MCS advanced laser technology has been created to satisfy the photovoltaic market's demands for increasing module power output and service life.

It allows for the maximum throughputs when dividing cells into half-cells or shingled cells up to M12/G12 sizes.The technology is appropriate for solar cells with temperature-sensitive coatings or depositions such as heterojunction (HJT) devices and is said to be able to generate more than 6,000 wafers per hour.

Without reducing throughput, the system can cut up to sixth-cut cells, depending on the number of laser sources.The system features a one-pass contactless dicing process and is based on the exclusive thermal laser separation technology of 3-D Micromac.

This, according to the firm, permits the production of solar cells with noticeably improved mechanical stability.An outstanding edge quality is guaranteed by the ablation-free process.

As a result, the separated cells permit a reduced power degradation over the lifetime of the solar module and have up to 30% higher mechanical strength than ablative laser methods.

COMPANY PROFILE

• Forgenano
• Solvay
• Micro Chemicals
• ENF solar
• Ooitech

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many solar cell  wafer slicing equipment are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global solar cell  wafer slicing equipment and key vendor selection criteria
3. Where is the solar cell  wafer slicing equipment manufactured? What is the average margin per unit?
4. Market share of Global solar cell  wafer slicing equipment market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global solar cell  wafer slicing equipment in-house
6. key predictions for next 5 years in Global solar cell  wafer slicing equipment market
7. Average B-2-B solar cell  wafer slicing equipment market price in all segments
8. Latest trends in solar cell  wafer slicing equipment market, by every market segment
9. The market size (both volume and value) of the solar cell  wafer slicing equipment market in 2023-2030 and every year in between?
10. Production breakup of solar cell  wafer slicing equipment market, by suppliers and their OEM relationship