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Last Updated: Apr 25, 2025 | Study Period: 2023-2030
INTRODUCTION
A discrete space in topology is a very straightforward illustration of a topological space or a structure comparable to it, one in which the points form a discontinuous sequence and are therefore somewhat isolated from one another.
The best topology that can be applied to a set is the discrete topology. In particular, every singleton subset is an open set in the discrete topology since every subset is open in that topology.
On a discrete metric space, the underlying uniformity is the discrete uniformity, and on a discrete uniform space, the underlying topology is the discrete topology.As a result, the many concepts of discrete space can coexist.On the other hand, a non-discrete uniform or metric space's underlying topology may be discrete.
A semiconductor device made specifically for use in the harsh conditions of space is known as a space semiconductor. Space semiconductors must be resistant to strong radiation exposure, a wide range of temperature fluctuations, as well as space's vacuum.
Satellites, spacecraft, and telescopes are just a few of the space-based devices that utilise space semiconductors. In space exploration missions like the Mars rover Curiosity, they are also employed. Many space-based systems depend on space semiconductors to work in the harsh environment of space. Space semiconductors are a crucial component of many systems.
GLOBALSPACE GRADE DISCRETEMARKET SIZE AND FORECAST
The Global Space grade Discrete market accountedfor $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
RECENT DEVELOPMENT
Texas Instruments (TI) (Nasdaq: TXN) today announced an expansion of its line of analog semiconductor components for use in space that are housed in highly dependable plastic packages for a variety of missions.
For radiation-hardened electronics, TI created a new device screening specification called space high-grade in plastic (SHP) and released new analog-to-digital converters (ADCs) that satisfy the SHP qualification.
The portfolio of radiation-resistant Space Enhanced Plastic (Space EP) product families was expanded by TI. Plastic packages have a smaller footprint than conventional ceramic packaging, which allows designers to minimise system-level size, weight, and power and, as a result, lower launch costs.
Wideband gap semiconductor materials are becoming more popular, which will encourage growth. The development of the market for space semiconductor devices is anticipated to be fueled by rising R&D and investment in the space sector.
The researchers created a broad band gap semiconductor material that enables end customers to create space product solutions that are more affordable, lighter, smaller in size, and have higher power efficiency.
Wide bandgap semiconductor material technologies like silicon carbide (SC) and gallium nitride (GaN) are made more popular by these features (SiC).
GaN and SiC materials can operate at extremely high temperatures and are radiation resistant. These materials are therefore appropriate for creating cutting-edge space system components like HEMTs and FETs.
Ceramic Qualified Manufacturers List (QML) Class V devices with hermetically sealed construction have previously been utilised in space applications and projects to ensure reliability.
Currently, short-duration missions in low Earth orbit (LEO) are increasing commercial access to space programs and assisting in the expansion of communication and connection.
Smaller components are increasingly needed for new space applications because they can assist in reducing system size and weight, which lowers the cost of launching an application into space.
Devices with plastic encapsulation and plastic substrate ball-grid array (PBGA) are an alternative to conventional space semiconductor packaging.
COMPANY PROFILE
THIS REPORT WILL ANSWER FOLLOWING QUESTIONS
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2023-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2023-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2023-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |