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Last Updated: Apr 25, 2025 | Study Period: 2022-2030
A plug-in card (PIC) can be made using the SpaceVPX standard by using the slot profile and module (protocol) profiles. These building pieces produce linked subsystems and systems as a result.
It is the outcome of a partnership between the government and industry and was created under the aegis of The Next Generation Space Interconnect Standard (NGSIS).
The main objective of SpaceVPX is to effectively eliminate bandwidth as a barrier for upcoming space systems
.The VITA (VMEbus International Trade Association) OpenVPX standard is the foundation of SpaceVPX, which has been extended for use in space applications.
SpaceVPX can be prototyped and tested on the ground using OpenVPX.
With regard to connector-pin assignments for the board and the backplane, SpaceVPX aims to provide a tolerable level of fault tolerance while preserving a tolerable level of compatibility with existing OpenVPX components.
The Global Space VPX system market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
The 3U Space VPX product family from Aitech Defense Systems Inc. is based on the low-power Intel Core i7 processor and enables extremely high computing within very small spaces.
Aitech Defense Systems Inc. is a pioneer in true military VMEbus technologies and an independent manufacturer of open architecture boards and subsystem products for defence and aerospace applications.
Using two cores and four threads, the new Core i7 can process data thanks to Intel's hyperthreading technology.
The C870 SBC, part of the new 3U space VPX family, has a Core i7 dual-core processor that can operate at speeds of 2.53 GHz for high performance, 2 GHz for low power, or 1.33 GHz for ultra low power requirements.
It also has an on-board Intel Gen 5.75 high-performance graphics controller with 12 execution units that can process, shade, and render 2D/3D graphics. Each processor core has an on-chip 256 kB L2 cache, 32 kB data and instruction L1 cache, and a shared 4 MB L3 cache.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
21 | Product installation rate by OEM, 2022 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2022 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |