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Last Updated: Apr 25, 2025 | Study Period: 2022-2030
Obtaining high value, low leakage, and small size in capacitors for high voltage applications is challenging. These performance criteria are met by KYOCERA AVX special high voltage MLC chip capacitors, which are intended for use in applications including high voltage coupling/dc blocking, resonators in SMPS, and snubbers in high frequency power converters.
Low ESRs are visible at high frequencies in these high voltage semiconductor designs. In order to produce high voltage MLC chip products, larger physical sizes than those typically used in chips are necessary.
When using these chips in surface mount assemblies, more care must be taken. When heating or cooling cycles are in progress, the temperature gradient shouldn't exceed 4oC per second. The ceramic bodies' peak temperature during the soldering operation must be within 50oC of the preheat temperature.
The Global Surface Mount MLCC market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
From mission-critical space applications to commercial applications, KYOCERA AVX provides a broad selection of surface mount MLCCs. There are several case sizes, capacitance values, voltage ratings, and termination options for KYOCERA AVX MLCCs.
There are Class 1 and Class 2 formulations of KYOCERA AVX Surface Mount MLCCs. Formulations with temperature compensation go under Class 1, while formulations with temperature stability and wide use fall under Class 2.
Recently, a broader selection of surface-mount multilayer ceramic capacitors (MLCCs) with safety certification was introduced for use in electronic device applications.
The new capacitors meet the requirements of AEC-Q200 standards, modems, and AC-DC power supplies where a lightning strike or other voltage transients pose a threat to electronic equipment, and they give consumers a rare combination of capability and safety certification.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
21 | Product installation rate by OEM, 2022 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2022 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |