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Last Updated: Apr 25, 2025 | Study Period: 2022-2030
Surface mount devices dominated the vast majority of high-tech electronic printed circuit assemblies by the late, even though they only accounted for 10% of the market. IBM was responsible for much of the groundbreaking work in this technology.
Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. This was the design approach that was first demonstrated by IBMâ in a small computer. It was later applied in the Launch Vehicle Digital Computer that was used in the Instrument Unit that guided all Saturn IB and Saturn V vehicles.
Surface mounting allowed for much higher circuit densities and smaller circuit boards, which in turn allowed for machines or subassemblies containing the boards to become much smaller. In addition, component placement on both sides of a board became much more common with surface mounting than with through-hole mounting.
The solder's surface tension frequently is sufficient to secure the components to the board; Adhesive is occasionally used to hold SMT components on the bottom side of a board if a wave soldering process is used to solder both SMT and through-hole components simultaneously.
The global surface mount photo reflector ic market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
A high brightness infrared LED and a highly sensitive phototransistor are built into the compact surface mount type photo reflector known as the NJL5912R by Nisshinbo Micro Devices Inc. The COBP technology was used to create this product, which is 0.5mm thin.
Applications comprise Finding the Lens unit for the camera module on a mobile phone, determining the position of the needle for a radio-controlled watch, Finding the original encoder point.
One of the most notable partnerships in the Surface Mount Type Photo Reflector IC market is between Lite-On Technology Corporation and ams AG. The two companies have joined forces to develop a range of products for the automotive industry.
This includes products such as automotive LED lighting, sensors, and RFID tags, and photo reflectors. The partnership will enable Lite-On to expand its presence in the automotive market and gain access to amsâs advanced technologies.
Vishay Intertechnology, a global semiconductor provider, has entered into a multi-year collaboration agreement with ROHM Semiconductor to develop and manufacture surface-mountable photo reflector ICs.
The two companies have also established a shared development framework to speed up the development process. In addition, the partnership includes the supply of components, manufacturing and testing services to the market.
Lite-On Semiconductor Corporation has partnered with Cree, Inc. to develop high-performance photo reflector ICs.
The partnership will focus on the development of a new family of components that offer improved performance and reliability, as well as reduced power consumption. The two companies have also agreed to collaborate on the development and manufacturing of new products and solutions.
CEL, a leading manufacturer of surface mount type photo reflector ICs, has partnered with SmartSensTechnologyCo. Ltd to develop new products. The two companies have come together to create a comprehensive suite of products that are designed to meet the needs of various industrial and automotive applications.
The partnership also includes the development of advanced technologies that will improve the performance and reliability of the components.
Another notable partnership in the Surface Mount Type Photo Reflector IC market is between Avago Technologies and ON Semiconductor. This collaboration has enabled the two companies to develop a range of products for the consumer electronics market.
These products include photo reflectors, sensors, and RFID tags. The partnership has enabled Avago to gain access to ON Semiconductorâs advanced technologies and expand its presence in the consumer electronics market.
In addition to partnerships, the Surface Mount Type Photo Reflector IC market has also seen a number of acquisitions. One of the most significant acquisitions was the purchase of Anadigics by Skyworks Solutions.
This acquisition gave Skyworks access to Anadigicsâs range of photo reflectors and other products. This enabled Skyworks to expand its presence in the consumer electronics market and gain access to Anadigicsâs advanced technologies.
Additionally, the Surface Mount Type Photo Reflector IC market has seen a number of other acquisitions in recent months.
For example, STMicroelectronics acquired Atmel Corporation in an effort to gain access to Atmelâs range of photo reflectors. This acquisition enabled STMicroelectronics to expand its presence in the consumer electronics market and gain access to Atmelâs advanced technologies.
Overall, the Surface Mount Type Photo Reflector IC market has seen a number of partnerships and acquisitions over the past year. These partnerships and acquisitions have been beneficial for both companies involved and have enabled them to access new markets and gain an edge on their competitors.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
| 21 | Product installation rate by OEM, 2022 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2022 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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