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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
An extremely thin thermal interface material in the form of a thin film is called a thermal conductive sheet. It is created by dispersing and combining silicone resin, which has excellent heat resistance and electrical insulation properties, with thermally conductive powder.
Thermal conductivity is a measure of a material's ability to pass heat through it. Materials with a high thermal conductivity can effectively transfer heat and readily take up heat from their environment.
The term "thermal conductivity" describes a material's capacity to conduct or transfer heat. In addition to the letter "k," it can also be represented by the symbols ``'' and "." Thermal resistivity is the name given to this quantity's reciprocal.
Thermal conductors are used to transfer thermal energy from one place to another.all metals, silver has the highest electrical conductivity. Currently, conductivity is described by silver and all other metals are measured to it. Silver is 100 on a scale of 0 to 100, with copper at 97 and gold at 76.
By using a thermal conductive sheet with high thermal conductivity, we can eliminate the bottleneck of heat release, efficiently release heat and reduce the temperature of a heat source such as a CPU. We verified the heat release effect due to high thermal conductivity by using a simple simulation model below.
Global thermal conductive sheet market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The phase change material GCS-TRP35-PCM, the most recent addition to the Global Component Sourcing (GCS) brand's line of thermal interface materials, is now available from European Thermodynamics.
The GCS-TRP35-PCM phase change thermal interface material is used to fill air gaps/voids between two surfaces and is best suited to fill spaces of up to 0.15mm. To cool, this offers total thermal contact.
Overall thermal conductivity of an embedded system is enhanced as heat is allowed to flow through the system and disperse. This allows the electronics to function as intended.Increased component density and smaller form factor engineering designs are now possible.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |