GLOBAL THERMAL INTERFACE MATERIALS MARKET

INTRODUCTION

 Any material that is put between two components to improve the thermal interaction between them is referred to as a thermal interface material (commonly abbreviated as TIM).

One frequent application is for heat dissipation, which involves inserting the TIM between two heat-producing components (such as integrated circuits) and two heat-dissipating components.Heat dissipation is hampered at each interface by a thermal resistance. 

Furthermore, with constant overheating and high thermal stress at the interfaces, the electronic performance and device longevity can be severely compromised.

There have been significant efforts made to create improved TIMs in order to reduce thermal boundary resistance between layers, improve thermal management performance, and address application requirements like low thermal stress between materials with different thermal expansion coefficients, low elastic modulus or viscosity, flexibility, and reusability.

GLOBAL THERMAL INTERFACE MATERIALS MARKET SIZE AND FORECAST

The Global thermal interface materials market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

NEW PRODUCT LAUNCH

The "Thermexit '' Line of Thermal Interface Materials was Launched by Nanoramic Laboratories.  Thermexit-HP-40, a high performance TIM Gap Filler, and Thermexit-El-20, an electrically insulating TIM Gap Filler, are two products in the Thermexit series.

Thermexit gap filler pads are the only thermal management system on the market that offers good thermal conductivity without the usage of silicone-based glue. 

As a result, any problems with silicone oil that could lower TIM function and damage electrical components are eliminated. Long ago, Nanoramic created energy-storing nanomaterial with a focus on setting performance records in hot settings.

They have developed the Thermexit family of thermal interface materials using their expertise in developing the thermal properties of materials at the nanoscopic scale to enable high performance thermal management across a variety of applications.

The thermal interface material (tim), developed by Infineon Technologies AG to lessen contact resistance between the metal surface of power semiconductors and the heat sink, has been successfully introduced. 

Customers may witness for themselves how much conductivity was improved by the heat conducting paste by utilising the econopack + of the new d series. Infineon is currently intending to increase the range due to high client demand.

Tim will be pre-applied to the product groups 62mm, econodual, and primepack in the first quarter . The modules econopack 4 and primepack as well as econo 2 and 3 are expected to be available with the programme by the end of the first half.

COMPANY PROFILE

• Würth Elektronik
• TE Connectivity
• Vicor
• MG Chemicals
• Panasonic

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many thermal interface materials are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global thermal interface materials and key vendor selection criteria
3. Where are the thermal interface materials manufactured? What is the average margin per unit?
4. Market share of Global thermal interface materials market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global thermal interface materials in-house
6. key predictions for next 5 years in Global thermal interface materials market
7. Average B-2-B thermal interface materials market price in all segments
8. Latest trends in thermal interface materials market, by every market segment
9. The market size (both volume and value) of the thermal interface materials market in 2023-2030 and every year in between?
10. Production breakup of thermal interface materials market, by suppliers and their OEM relationship