
- Get in Touch with Us
Last Updated: Apr 25, 2025 | Study Period: 2024-2030
Thermal Scanning Probe Lithography (TSPL) is a revolutionary technique for producing nanoscale structures. It is a direct-write method of lithography which uses a heated atomic force microscope (AFM) tip to locally heat and melt a resist layer. The resist layer is used as a mask to create a nano-scale pattern on a substrate.
TSPL is a cost-effective, low-temperature, low-pressure lithography technique that is suitable for a range of applications, including the fabrication of nanostructures and nanodevices.
TSPL has several advantages over traditional photolithography. It is a direct-write technique, meaning that the pattern is written with the AFM tip directly onto the substrate. This eliminates the need for masks and other costly photolithography tools. This also allows for greater flexibility and control over the patterning process.
Additionally, TSPL is a low-temperature and low-pressure process, which allows for the fabrication of more sensitive and fragile materials. Finally, TSPL has high resolution capabilities, allowing for the production of features as small as 10 nanometers.
TSPL is an ideal tool for the fabrication of nanostructures and nanodevices. It can be used to pattern a variety of materials, including metals, semiconductors, and organic materials. This makes it a powerful tool for the fabrication of nanostructures and nanodevices with customizable designs. Additionally, TSPL can be used to fabricate complex structures in a single step, which reduces fabrication time and cost.
TSPL is an important tool for the development of nanotechnology. It has enabled researchers to create nanoscale structures with unprecedented precision, paving the way for the development of new and innovative nanodevices. In the future, TSPL is likely to become an even more important tool for the fabrication of nanostructures and nanodevices.
The Global Thermal Scanning Probe Lithography Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Ãcole Polytechnique Fédérale de Lausanne researchers have carved nanometric patterns into two-dimensional materials using a high-precision nanolithography technique. These approaches can be divided into two categories: bottom-up approaches, which construct structures molecule-by-molecule or atom-by-atom, and top-down approaches, which generate nanoscale structural architectures by etching away bulk material.
Integrated circuits are one of the many uses of top-down approaches to nanostructure fabrication that are still prevalent in the semiconductor industry. In particular, lithographic methods that is, methods for transferring a pattern onto a surface are frequently employed.
Typical lithographic methods etch patterns into a surface by means of light, electron, or ion beams. These methods, while effective in producing nanostructures on most surfaces, present certain difficulties when attempting to shape two-dimensional materials.
Developing a scalable and cost-effective nanofabrication method is of key importance for future advances in nanoelectronics. Thermal scanning probe lithography (t-SPL) is a growing nanopatterning method with the potential for parallelization, offering unique capabilities that make it an attractive candidate for industrial nanomanufacturing. APL Materials demonstrate the possibility of applying t-SPL to fabricate graphene devices.
In particular, they use t-SPL to produce high-performing graphene-based field effect transistors (FETs). The t-SPL process includes the fabrication of high-quality metal contacts, as well as patterning and etching of graphene to define the active region of the device.
The electrical measurements on the t-SPL fabricated FETs indicate a symmetric conductance at the Dirac point and a low specific contact resistance without the use of any contact engineering strategy.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |