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Last Updated: Apr 26, 2025 | Study Period: 2022-2030
Thermal warpage inspection systems develop temperature control profiles and, under varied temperature conditions, quickly and accurately measure the warpage of a substrate that has been placed on the designated tray.
The relevance of measuring temperature-dependent warpage (thermal warpage) has been growing, and these systems can produce temperature control profiles (between ambient temperature and 300°C) and measure the warpage of a substrate placed on the plate.
A thermal warpage measurement device that can satisfy the requirements of the standard and alter the sample temperature from -60 to 260 ââ.
The global thermal warpage inspection system market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Akrometrix The Tabletop Shadow Moiré (TTSM) system, the newest warpage metrology system from Akrometrix, LLC, the leading supplier of thermal warpage and strain metrology equipment to the front- and back-end semiconductor and electronics industries, has just been released. New Warpage Metrology System is released.
The TTSM satisfies this need by allowing clients to measure substrate warpage up to 300mm x 310mm (a 300mm wafer or two JEDEC trays) in less than two seconds. The TTSM offers a tabletop-friendly, incredibly quick and highly accurate measurement at room temperature for both individual parts and a JEDEC tray of several parts.
Takaoka Toko Ltd.'s compact thermal warpage inspection system, the HVI-8000C-RC/EC.
Without the necessity for sample preparation, such as bump removal, or paint treatment, required by a general warpage inspection apparatus, warpage inspection can be carried out under reflow temperature or set temperature circumstances. The maximum size of the work that is applicable is 100x100mm, and a high-speed convection heater with a heating speed of 3°C/sec is incorporated.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
21 | Product installation rate by OEM, 2022 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2022 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |