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Thermal warpage inspection systems develop temperature control profiles and, under varied temperature conditions, quickly and accurately measure the warpage of a substrate that has been placed on the designated tray.
The relevance of measuring temperature-dependent warpage (thermal warpage) has been growing, and these systems can produce temperature control profiles (between ambient temperature and 300°C) and measure the warpage of a substrate placed on the plate.
A thermal warpage measurement device that can satisfy the requirements of the standard and alter the sample temperature from -60 to 260 â„.
The global thermal warpage inspection system market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Akrometrix The Tabletop Shadow Moiré (TTSM) system, the newest warpage metrology system from Akrometrix, LLC, the leading supplier of thermal warpage and strain metrology equipment to the front- and back-end semiconductor and electronics industries, has just been released. New Warpage Metrology System is released.
The TTSM satisfies this need by allowing clients to measure substrate warpage up to 300mm x 310mm (a 300mm wafer or two JEDEC trays) in less than two seconds. The TTSM offers a tabletop-friendly, incredibly quick and highly accurate measurement at room temperature for both individual parts and a JEDEC tray of several parts.
Takaoka Toko Ltd.’s compact thermal warpage inspection system, the HVI-8000C-RC/EC.
Without the necessity for sample preparation, such as bump removal, or paint treatment, required by a general warpage inspection apparatus, warpage inspection can be carried out under reflow temperature or set temperature circumstances. The maximum size of the work that is applicable is 100x100mm, and a high-speed convection heater with a heating speed of 3°C/sec is incorporated.
