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Last Updated: Apr 25, 2025 | Study Period: 2023-2030
A PCB material expands at a specific rate when it heats up, which is known as the coefficient of thermal expansion, or CTE.
With each degree of heating, CTE expands by parts per million (ppm), which is how it is measured. The CTE increases together with a material's temperature as it approaches Tg.
The combined thickness and the individual copper and glass-epoxy thicknesses of a PCB affect its effective thermal conductivities.
Due to metal's strong thermal conductivity, using a metal core for your FR4 or other board might aid heat transfer occur more quickly.
The Global Thermally enhanced PCB market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
Laird Technologies Releases Enhanced Tlam SS LLD Thermally Conductive PCB Substrate.The launch of its improved Tlam SS LLD, which may be used as a substrate for thermally conductive printed circuit boards (PCBs).
The Tlam SS LLD is a flexible, thermally-enhanced PCB substrate technology designed especially for heat dissipation in applications using brilliant and ultra-bright LED modules.
When compared to traditional FR4-based PCBs, the thermally conductive PCB substrate dissipates heat 8â10 times more efficiently, which is essential for keeping components cool.
The LLD dielectric used in the bonding of the copper circuit layer and aluminium or copper base plate is crucial to the excellent performance of the PCB substrate.
Without changing any parameters, the dielectric may fit inside and be processed by typical FR4 print-and-etch procedures. These dielectrics offer the substrate an adhesive layer, heat conduction, and electrical isolation.
The improved Tlam SS LLD substrate reduces the thermal stress put on PCBs by enhancing thermal transference from the heat source to the heat sink through PCBs.
These new developments help the LED industry by giving the LED equipment a longer operating life and a better performing, more affordable thermal interface.
Laird Technologies continues to lead the market in providing thermally-conductive PCB substrates for applications demanding the finest thermal performance and resilience to thermal cycling as electronic device reduction continues to pack more power into smaller packages.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
| 21 | Product installation rate by OEM, 2022 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2022 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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