THERMO-COMPRESSION BONDING SYSTEM MARKET

INTRODUCTION

The semiconductor industry uses the thermo-compression bonding system, also known as thermocompression bonding or thermocompression bonding equipment, to make electrical connections between substrates and microchips or integrated circuit (IC) packages. It is a method of connecting chips to substrates that combines pressure and heat to create a solid, high-quality bond.

The following essential steps are involved in thermo-compression bonding:

•  Alignment: To guarantee accurate positioning of the electrical contact pads, the IC chip or package is aligned with the substrate.
• Heating: The system is heated, usually with the aid of a heated tool or hot plate. The materials for the metal interconnects are softened by carefully regulating the temperature.
• Pressure: The chip or package is subjected to a regulated force or pressure that presses it up against the substrate. The bonding materials are able to make close contact with one another thanks to this pressure.
• Intermetallic Bond Formation: The metal interconnects go through a diffusion process as the materials are heated and pushed together. Intermetallic bonds are created between the chip or package and the substrate as a result

Thermo-compression bonding has several benefits, including:

• High reliability: The electrical connection is strong and reliable thanks to thermo-compression bonding. Strong adhesion between the chip or package and the substrate is created by the intermetallic bonds produced during the process, resulting in high electrical performance and mechanical stability.
• Fine-pitch capability: Thermo-compression bonding makes it possible to join with high-density interconnects, enabling connections between the chip and the substrate with a finer pitch. For cutting-edge semiconductor devices with tiny features, this is essential.
• Low-temperature processing: Thermo-compression bonding acts at lower temperatures than conventional bonding methods like soldering. This can reduce the possibility of damage or heat stress for substrates or components that are temperature-sensitive.

Advanced packaging techniques including flip chip bonding, chip-on-flex bonding, and chip-on-glass bonding all make use of thermo-compression bonding methods. Typically, specialized equipment vendors in the semiconductor sector design and produce these systems.

THERMO-COMPRESSION BONDING SYSTEM MARKET SIZE AND FORECAST

The Global Thermo-compression Bonding System market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

THERMO-COMPRESSION BONDING SYSTEM MARKET OUTLOOK

• The semiconductor market is expected to experience strong growth in 2024 (15-20%) after a slow start in 2023.
• Europe was the only regional market that saw annual sales growth of 4.0% in 2023, while other regions declined.
• The key semiconductor product segments that did well in 2023 are logic, memory, microcontrollers, and automotive ICs
• The Asia-Pacific automotive semiconductor market accounts for one-third of the global total, with Japan as the clear leader. This is due to the higher degree of intelligent autonomy in vehicles, which requires more control chips and storage capacity.
• Logic products (CPUs, GPUs, FPGAs) dominated with $178.5 billion in sales, accounting for over 60% of the industry’s total revenue. Memory followed with $92.3 billion, despite declining prices. Notably, both categories saw year-over-year declines except for GPUs, highlighting the industry’s current challenges.
• Korean Consumer electronics and Chip manufacturer Samsung reported 10X growth in Q1-2024 profit YOY whereas LG reported its best ever quarter in the history of the company

THERMO-COMPRESSION BONDING SYSTEM MARKET NEW PRODUCT LAUNCH

A significant customer has received the first Fluxless Thermo-Compression Bonder (TCB) from Kulicke and Soffa Industries. The demand for advanced semiconductor assembly equipment is rising quickly as a result of the increased packaging complexity of high-volume generic semiconductors. New assembly methodologies are required for future logic, processor, mixed-signal, silicon photonics, and sensor applications using heterogeneous integration (HI), also known as chiplets and System-in-Package (SiP).

Through a distinct and integrated fluxless delivery module, the fluxless TCB method avoids contamination concerns while preserving connection integrity. This provides down to 10 m support for the majority of developing heterogeneous packaging needs.

THERMO-COMPRESSION BONDING SYSTEM MARKET COMPANY PROFILE

• ASM Pacific Technology
• Besi
• Kulicke & Soffa
• Mitsubishi Heavy Industries
• Shibaura Mechatronics Corporation
• Palomar technologies

THERMO-COMPRESSION BONDING SYSTEM MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Thermo-compression Bonding Systems are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Thermo-compression Bonding System and key vendor selection criteria
3. Where is the Thermo-compression Bonding System manufactured? What is the average margin per unit?
4. Market share of Global Thermo-compression Bonding System market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Thermo-compression Bonding System in-house
6. key predictions for next 5 years in Thermo-compression Bonding System market
7. Average B-2-B Thermo-compression Bonding System market price in all segments
8. Latest trends in Thermo-compression Bonding System market, by every market segment
9. The market size (both volume and value) of the Thermo-compression Bonding System market in 2024-2030 and every year in between?
10. Production breakup of Thermo-compression Bonding System market, by suppliers and their OEM relationship