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An effective and space-saving method for mounting integrated circuits (ICs) onto printed circuit boards (PCBs) is the Thin Shrink Small Outline Package (TSSOP), a form of surface mount IC package.
TSSOP packages are often utilised in a wide range of electronic products, including telecommunications equipment, consumer electronics, and industrial applications.
The TSSOP package is excellent for space-constrained designs with limited PCB real estate because of its compact footprint and low profile. It has a rectangular body with leads extending on two of its opposing sides, making surface installation to the PCB simple.
The term “thin” in TSSOP refers to the package’s low profile, which aids in lowering the constructed PCB’s overall height.
This is particularly crucial for compact devices or applications with height limitations.
Depending on the particular IC, the TSSOP package is available in a variety of pin layouts, ranging from 8 to 64 pins or more. TSSOP packages’ leads are commonly organised with a pitch (spacing) of 0.5mm or 0.65mm, allowing for high-density installation and effective PCB area utilisation.
The Global Thin Shrink Small Outline Package(Tssop) Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
The Thin Shrink Small Outline packaging (TSSOP) from Amkor Technology offers lower body sizes, smaller lead pitches, and a thinner packaging (0.9mm thick) than conventional SOIC packages. The sizes of the bodies are 3.0mm, 4.4mm, and 6.1mm. 8 to 80 lead counts are possible.
The JEDEC package outlines are followed by this package.For body widths of 4.4 and 6.1mm, the body thickness is 0.9mm.3.0mm body width and 0.85mm body thickness.A typical package outline is JEDEC and leadframes made of high conductivity copper.
The mould compound with very little tension.Tube counts might change.Upon request, parts are available on tape and reel.100% Matte Sn alloy is offered with lead-free options.
