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INTRODUCTION
Surface-mount memory packaging techniques like the Thin Small Outline Package (TSOP) are frequently employed in electrical devices. It is a kind of chip package that is made to be more compact and thin than other kinds of packages, making it perfect for usage in small, space-constrained electronic devices.
The TSOP package is rectangular in shape and features leads or pins on its two opposing sides. With a standard grid arrangement and pin spacing between 0.5mm and 1.27mm, it is possible to fit a lot of leads on a compact box. The TSOP package, which comes in a variety of sizes and pin counts, is frequently used to package memory chips, such as flash memory or DRAM.
The TSOP package has the benefit of being relatively simple to manufacture, which lowers its cost. It is perfect for use in portable electronic devices like smartphones, tablets, and digital cameras because it is lightweight and small.
The TSOP packaging does, however, have significant drawbacks. Because to the smaller and closer-spaced leads compared to other package designs, including the Quad Flat Package (QFP), it may be more challenging to deal with. Moreover, the thermal performance of the TSOP package is less than that of some other packages, which might be problematic in high-temperature situations.
GLOBAL THIN SMALL OUTLINE PACKAGING (TSOP) MARKET SIZE AND FORECAST
Global thin small outline packaging (TSOP) market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
NEW PRODUCT LAUNCH
Texas Instruments (TI) always has been a leader in IC packaging and is now introducing a new family of thin very small-outline
packages (TVSOP) to support the component miniaturization requirements of the industry. The new TVSOP package family,
in 14-, 16-, 20-, 24-, 48-, 56-, 80-, and 100-pin types, features a lead pitch of 0.40 mm (16 mil) and a device height meeting
the 1.2-mm Personal Computer Memory Card International Association (PCMCIA) requirement. The TVSOP packages have
received Joint Electronics Device Engineering Council (JEDEC) registration under semiconductor package standard MO-194.
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