Global Thin Small Outline Packaging (TSOP) Market 2023-2030

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    Global Thin Small Outline Packaging (TSOP) Market



    Surface-mount memory packaging techniques like the Thin Small Outline Package (TSOP) are frequently employed in electrical devices. It is a kind of chip package that is made to be more compact and thin than other kinds of packages, making it perfect for usage in small, space-constrained electronic devices.


    The TSOP package is rectangular in shape and features leads or pins on its two opposing sides. With a standard grid arrangement and pin spacing between 0.5mm and 1.27mm, it is possible to fit a lot of leads on a compact box. The TSOP package, which comes in a variety of sizes and pin counts, is frequently used to package memory chips, such as flash memory or DRAM.


    The TSOP package has the benefit of being relatively simple to manufacture, which lowers its cost. It is perfect for use in portable electronic devices like smartphones, tablets, and digital cameras because it is lightweight and small.


    The TSOP packaging does, however, have significant drawbacks. Because to the smaller and closer-spaced leads compared to other package designs, including the Quad Flat Package (QFP), it may be more challenging to deal with. Moreover, the thermal performance of the TSOP package is less than that of some other packages, which might be problematic in high-temperature situations. 



    infographic: Small Outline Integrated Circuit (SOIC) Packaging Market


    Global thin small outline packaging (TSOP) market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.



    Texas Instruments (TI) always has been a leader in IC packaging and is now introducing a new family of thin very small-outline


    packages (TVSOP) to support the component miniaturization requirements of the industry. The new TVSOP package family,


    in 14-, 16-, 20-, 24-, 48-, 56-, 80-, and 100-pin types, features a lead pitch of 0.40 mm (16 mil) and a device height meeting


    the 1.2-mm Personal Computer Memory Card International Association (PCMCIA) requirement. The TVSOP packages have


    received Joint Electronics Device Engineering Council (JEDEC) registration under semiconductor package standard MO-194.





    1. How many thin small outline packaging (TSOP) are manufactured per annum globally? Who are the sub-component suppliers in different regions?
    2. Cost breakup of a Global thin small outline packaging (TSOP) and key vendor selection criteria
    3. Where is the thin small outline packaging (TSOP) manufactured? What is the average margin per unit?
    4. Market share of Global thin small outline packaging (TSOP) market manufacturers and their upcoming products
    5. Cost advantage for OEMs who manufacture Global thin small outline packaging (TSOP) in-house
    6. key predictions for next 5 years in Global thin small outline packaging (TSOP) market
    7. Average B-2-B thin small outline packaging (TSOP) market price in all segments
    8. Latest trends in thin small outline packaging (TSOP) market, by every market segment
    9. The market size (both volume and value) of the thin small outline packaging (TSOP) market in 2023-2030 and every year in between?
    10. Production breakup of thin small outline packaging (TSOP) market, by suppliers and their OEM relationship


    Sl no Topic
    1 Market Segmentation
    2 Scope of the report
    3 Abbreviations
    4 Research Methodology
    5 Executive Summary
    6 Introduction
    7 Insights from Industry stakeholders
    8 Cost breakdown of Product by sub-components and average profit margin
    9 Disruptive innovation in the Industry
    10 Technology trends in the Industry
    11 Consumer trends in the industry
    12 Recent Production Milestones
    13 Component Manufacturing in US, EU and China
    14 COVID-19 impact on overall market
    15 COVID-19 impact on Production of components
    16 COVID-19 impact on Point of sale
    17 Market Segmentation, Dynamics and Forecast by Geography, 2023-2030
    18 Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030
    19 Market Segmentation, Dynamics and Forecast by Application, 2023-2030
    20 Market Segmentation, Dynamics and Forecast by End use, 2023-2030
    21 Product installation rate by OEM, 2023
    22 Incline/Decline in Average B-2-B selling price in past 5 years
    23 Competition from substitute products
    24 Gross margin and average profitability of suppliers
    25 New product development in past 12 months
    26 M&A in past 12 months
    27 Growth strategy of leading players
    28 Market share of vendors, 2023
    29 Company Profiles
    30 Unmet needs and opportunity for new suppliers
    31 Conclusion
    32 Appendix
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