GLOBAL ULTRA LOW-K DIELECTRIC FILM MARKET

INTRODUCTION

In order to decrease signal delay and enhance the functionality of integrated circuits, ultra low-k dielectric films are a particular kind of material utilised in microelectronics.

Since it has a low dielectric constant (k value), electrical impulses can travel through it more quickly than through conventional dielectric materials, which have larger k values.

As integrated circuits have shrunk to nanoscale sizes, the utilisation of extremely low-k dielectric films has grown in significance.

This is because the interconnects that transmit electrical signals become more capacitive and resistive as a chip's feature sizes shrink. This may result in signal delay, which could lower the circuit's performance.

Typically, low density, high porosity organic or inorganic materials are used to create ultra low-k dielectric films. The material's pores lessen the density, which also lessens the dielectric constant.

Chemical vapour deposition, spin coating, and plasma-enhanced chemical vapour deposition are just a few of the methods used to deposit these layers.

 The low density and large porosity of extremely low-k dielectric films might make them more brittle and prone to breakage during processing, which is one of their problems.

This may result in decreased manufacturing yield and reliability problems. Researchers are striving to create novel materials and deposition methods that can maintain low-k characteristics while also enhancing the mechanical properties of the films in order to overcome these difficulties.

GLOBAL ULTRA LOW-K DIELECTRIC FILM MARKET SIZE AND FORECAST

Global Ultra low-K dielectric film market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

NEW PRODUCT LAUNCH

Black Diamond II, a low k solution from Applied Materials, uses NanoCure UV curing technology to produce an ultra-low-k dielectric film and offers a k-value of less than 2.5.

Black Diamond chemical vapour deposition (CVD) low k film from Applied Materials is being used by Taiwan Semiconductor Manufacturing Co. (TSMC) to produce their 0.13-micron copper chips.

Moreover, TSMC and Applied are collaborating to apply the technology in TSMC's next 0.2 performance processors. 

Using NanoCure UV curing technology, Applied Materials has introduced Black Diamond II low k solution with a k-value of less than 2.5. For the production of its copper chips, TSMC uses Applied's Black Diamond CVD low k film, and it intends to do the same for its next-generation chips.

Many businesses have decided on their preferred low-k material, including IBM's SiLK dielectric material and Black Diamond dielectric materials from AMD, Motorola, and TSMC.

COMPANY PROFILE

• TEL NEXX
• Henkel
• JSR Micro
• Fujikura Kasei
• Dow Chemical Company
• Applied Materials

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Ultra low-K dielectric film are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Ultra low-K dielectric film and key vendor selection criteria
3. Where is the Ultra low-K dielectric film manufactured? What is the average margin per unit?
4. Market share of Global Ultra low-K dielectric film market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Ultra low-K dielectric film in-house
6. key predictions for next 5 years in Global Ultra low-K dielectric film market
7. Average B-2-B Ultra low-K dielectric film market price in all segments
8. Latest trends in Ultra low-K dielectric film market, by every market segment
9. The market size (both volume and value) of the Ultra low-K dielectric film market in 2023-2030 and every year in between?
10. Production breakup of Ultra low-K dielectric film market, by suppliers and their OEM relationship