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Less than 1-2mm thick glass is referred to as ultra-thin glass. A piece of ultra-thin glass that is 0.1 mm thick may bend like a sheet of paper because of this material’s extraordinary flexibility. It is produced using a technique known as a “Draw Down” or “Fusion Draw.”
In this procedure, the glass is stretched vertically before being rolled into spools. From home windows and kitchen tools to the highly developed industries of telecommunication and aerospace, it is utilized everywhere. range of applications, improve way of life, and truly contribute to society.
The Global Ultra-Thin Glass Wafer market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Corning Introduces Ultra-Low TTV Glass Carrier Wafers, Providing Consumer Electronics with Faster, Smarter Technology Today, Corning Incorporated announced the availability of its new Ultra-Low TTV Glass Carrier Wafers, which support applications for 5G communication as well as advanced semiconductor fabrication.
The launch expands on the company’s current portfolio, which supports these markets that are expanding quickly. At the Electronic Components and Technologies Conference in San Diego, Corning will introduce its new glass wafers.
With the introduction of this new product, Corning continues to help and enhance the semiconductor industry. “The demand for this type of technology enables the production of faster, smarter consumer devices.”
The wafers feature one of the lowest total thickness variations (TTV) of any now on the market (0.2 m). When producing more sophisticated semiconductor chips, the ultra-low TTV is essential because it enables greater process control and support during temporary bonding and wafer-thinning procedures utilized in the stacking and packaging of integrated circuits (ICs).
Achieving total stack TTV of less than 10 m as ICs are packaged is excellent since it allows for thinner device wafers. Radio frequency (RF) filters used in 5G devices are improved in performance using thinning techniques.
For this kind of communication, more filters are required, and the usage of these wafers makes it possible to utilise filters with a higher frequency while simultaneously reducing the overall cost.
