GLOBAL ULTRA-THIN POWER MODULE MARKET

INTRODUCTION

An Ultra-Thin Power Module is an advanced power solution for electronic devices that have a small form factor. These modules are typically less than 1 mm thick, and provide a reliable and efficient source of power for a wide variety of electronics.

This technology is designed to provide a reliable and efficient power source for devices that require a small form factor and minimal power loss.

The Ultra-Thin Power Module utilizes a combination of advanced design technologies and cutting-edge materials to create a highly efficient, durable, and reliable power source.

The module is composed of a thin sheet of metal, typically aluminum or copper, which has been treated to reduce its thickness to less than 1 mm. This thin sheet of metal is then layered with other materials, such as conductive polymers, to create a thin yet strong and reliable power connection.

The Ultra-Thin Power Module also includes a series of electrical components, such as transistors, resistors, and capacitors, which are integrated into the module to provide a reliable and efficient source of power.

The components are embedded within the module, allowing for a slim and sleek design that can fit into even the most compact of spaces.

The Ultra-Thin Power Module is ideal for a wide variety of electronics, including wearables, medical devices, and other consumer electronics. Due to its small form factor, it can be easily integrated into a variety of devices, while providing a reliable and efficient source of power.

Furthermore, the module is designed to be durable and reliable, ensuring that it can withstand the elements and still provide a reliable source of power.

GLOBAL ULTRA-THIN POWER MODULE MARKET SIZE AND FORECAST

The Global Ultra-Thin Power Module market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

RECENT DEVELOPMENT

The HybridPACK Drive G2 is a new automotive power module from Infineon Technologies AG. It expands upon the well-established HybridPACK Drive G1 concept of an integrated B6 package, providing higher power and ease of use along with scalability within the same footprint. Different current ratings, voltage levels, and Infineon's next-generation chip technologies, EDT3 and CoolSiC G2 MOSFET, will be available for the HybridPACK Drive G2.

The HybridPACK Drive G2, which has a power range of up to 300 kW in the 750 V and 1200 V classes, offers exceptional user-friendliness along with innovative features that allow system cost savings, like on-chip temperature sensing for IGBT products and an integration option for next-generation phase current sensors. Higher performance and power density are achieved by the power module thanks to enhanced assembly and connect technologies. 

Higher temperature ratings are made possible by the use of new materials (new black plastic housing) and new interconnect technologies (chip sintering), which enhance performance and extend product life. Using silicon EDT2 technology, the first generation (G1) of HybridPACK Drive was unveiled. In the 750 V class, it provides a power range of 100 kW to 180 kW. With the first generation of HybridPACK Drive Automotive CoolSiC MOSFETs, Infineon increased the scope of its product line.

This allowed the inverter design to achieve more power up to 250 kW within the 1200 V class, as well as longer driving ranges, smaller batteries, and optimized system size and cost. Having sold close to 3 million units across numerous international electric vehicle platforms, Infineon's HybridPACK Drive is currently the industry's top power module.

NEW PRODUCT LAUNCH

Three silicon carbide (SiC) based power modules in transfer molded technology were announced by Onsemi, a leader in intelligent power and sensing technologies. These power modules are meant to be used in high voltage (HV) DCDC conversion and onboard charging in all kinds of electric vehicles (xEV). The APM32 series is made especially for high-power 11–22kW onboard chargers (OBC) and is the first of its kind to incorporate SiC technology into a transfer molded package to improve efficiency and reduce xEV charging times.

To handle the 800V bus voltage, all three of the modules have low conduction and switching losses, best-in-class thermal resistance, and high voltage isolation. In the end, the increased efficiency and decreased heat generation enable a more potent OBC. One that can extend the xEV's operating range and charge it more quickly two essential elements for customers.

The APM32 modules offer high levels of reliability thanks to Onsemi's end-to-end SiC supply chain capability and tested SiC MOSFETs and diodes. Each module is serialized for complete traceability. The modules guarantee dependability even in demanding, space-constrained automotive applications, with junction temperatures (Tj) as high as 175°C.

By utilizing Onsemi's best-in-class packaging, APM32 offers our customers a unique solution by maximizing the potential of cutting-edge silicon carbide technology. The NVXK2TR40WXT and NVXK2TR80WDT modules of the APM32 series are suitable for high-voltage battery stacks because they are configured in an H-bridge topology with a breakdown (V(BR)DSS) capability of 1200 V.

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Ultra-Thin Power Modules are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Ultra-Thin Power Module and key vendor selection criteria
3. Where is the Ultra-Thin Power Module manufactured? What is the average margin per unit?
4. Market share of Global Ultra-Thin Power Module market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Ultra-Thin Power Module in-house
6. key predictions for next 5 years in Global Ultra-Thin Power Module market
7. Average B-2-B Ultra-Thin Power Module market price in all segments
8. Latest trends in Ultra-Thin Power Module market, by every market segment
9. The market size (both volume and value) of the Ultra-Thin Power Module market in 2023-2030 and every year in between?
10. Production breakup of Ultra-Thin Power Module market, by suppliers and their OEM relationship