Global Ultrasonic Die Bonder Market 2023-2030

GLOBAL ULTRASONIC DIE BONDER MARKET

INTRODUCTION

The procedure of ultrasonic bonding, which is typically employed for flip chip bonding, enables the creation of a link that is both mechanically and electrically stable. Without the use of extra joining material, a chip is attached to a substrate using friction welding.

Chip and substrate surfaces must both be metallized for this. The majority of the time, those surfaces have so-called bumps that were either created chemically or by utilising a wire bonder. The bumps compensate for any potential tolerances and limit the contact area.

Ultrasonic energy and bond force application start diffusion processes between the contact surfaces, creating a reliable connection. The process itself just lasts a few milliseconds. It is referred to as thermosonic bonding if more heat is added from below.

This work describes the effect of using ultrasonic energy to lower the bonding temperature and time as well as void formation in state-of-the-art thermocompression bonding of thin silicon dies laminated with die attach film (DAF) on glass substrates.

Utilising in-house automated thermosonic bonding equipment with a ultrasonic transducer, process evaluations are carried out.

At different combinations of bonding temperature, time, and pressure as well as ultrasonic power of the transducer, the specimens bonded by the thermosonic process are contrasted with those bonded by the thermocompression process in terms of the percentage of void formation.

Using a digital optical microscopy approach, the voids created at the interface between the DAF and the glass substrate are analysed.

GLOBAL ULTRASONIC DIE BONDER MARKET SIZE AND FORECAST

The Global Ultrasonic Die Bonder market accountedfor $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.

RECENT DEVELOPMENT 

In its totally owned 20,000 square foot facility, QP Technologie, a leading provider of cutting-edge microelectronic packaging and assembly solutions, has installed two new Hesse Mechatronics ultrasonic wire bonders.

With the help of the fully automated bonders, QP Technologies is able to offer more sophisticated wedge bonding capabilities for important industries including radio frequency (RF), power, which includes silicon carbide (SiC) and gallium arsenide (GaN), and mil-spec/aerospace (mil-aero).

One of the key elements of our IC assembly skills is wire bonding. After giving it some thought, we concluded that the Hesse systems were the best fit for our wedge bond products," said Ken Molitor, chief operating officer of QP Technologies.

With the addition of these systems to our lineup, we are better able to meet customer demands for a larger variety of substrate and chip types within our core markets as well as for brand-new sectors, like tiny battery modules used in mobile and automotive applications.

The Hesse systems, the Bondjet BJ855 fine wire wedge bonder and the Bondjet HWW wedge bonder, both offer tiny footprints and industry-leading bonding speeds. The BJ855 has axis accuracy, ball-wedge and wedge-wedge bond heads, and improved pattern recognition.

RF and high-frequency components, chip-on-board (COB), multichip modules (MCM), hybrids, optical, and automotive electronics are examples of typical uses.

COMPANY PROFILE

• QP Technologies
• FINEPLACER
• SHEETALSONIC
• Panasonic
• PRONTOTEC

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How manyUltrasonic Die Bondersare manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a GlobalUltrasonic Die Bonderand key vendor selection criteria
3. Where is theUltrasonic Die Bondermanufactured? What is the average margin per unit?
4. Market share of Global Ultrasonic Die Bondermarketmanufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Ultrasonic Die Bonderin-house
6. 5 key predictions for next 5 years in GlobalUltrasonic Die Bondermarket
7. Average B-2-BUltrasonic Die Bondermarket price in all segments
8. Latest trends in Ultrasonic Die Bonder market, by every market segment
9. The market size (both volume and value) of theUltrasonic Die Bondermarket in 2022-2030 and every year in between?
10.  Production breakup ofUltrasonic Die Bondermarket, by suppliers and their OEM relationship