ULTRASONIC PROBE FPC BOARD MARKET

INTRODUCTION

They can be used in industrial and automotive processes to determine the thickness and density of concrete, metal, and other materials. They can also be used for medical imaging.

Ultrasonic probes are used in a variety of applications, including inspection of weld quality in industries, ultrasonic / level sensors, and measuring the distance to the target by measuring the time between emission and reception.

A PCB is a traditional circuit board that routes electrical signals through conductive pathways, whereas an FPC does the same but with a more compact design that is better suited for small electronics. 

ULTRASONIC PROBE FPC BOARD MARKET SIZE AND FORECAST

The Global Ultrasonic probe FPC Board market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

ULTRASONIC PROBE FPC BOARD MARKETNEW PRODUCT LAUNCH

Toposens Introduces New 3D Ultrasonic Sensor With Infineon XENSIVTM MEMS Microphone Toposens has partnered with Infineon Technologies AG to use Toposens' proprietary 3D ultrasonic technology for 3D obstacle detection and avoidance for autonomous systems.

The Munich-based sensor manufacturer offers the ECHO ONE DK, a 3D ultrasonic sensor that uses sound waves, machine vision, and advanced algorithms to provide robust, cost-effective, and accurate 3D vision for applications such as robotics, autonomous driving, and consumer electronics.

This simple-to-integrate 3D ultrasonic sensor enables safe obstacle avoidance while also detecting 3D obstacles. Infineon's XENSIVTM MEMS microphone, IM73A135V01, is used in the product.

The IM73A135V01, as a next-generation reference design solution, can assist customers in reducing the complexity of product development and shortening time to market.

Furthermore, it is less expensive and uses less energy than existing industrial 3D sensors. This innovative new technology is ideal for enhancing the performance of automated guided vehicles (AGVs).

Because their XENSIV MEMS microphones can detect sound pulses, they are critical components for 3D object localization via ultrasound.

They have an extremely low noise floor and an extremely high noise ceiling. The SNR (signal-to-noise ratio) property improves the reliability of the 3D data by allowing the detection of the faintest ultrasonic echoes from distant, complex, and smaller objects."

ULTRASONIC PROBE FPC BOARD MARKETCOMPANY PROFILE

• Toposens
• TE Connectivity
• Digikey
• FormFactor
• Autumn

THISULTRASONIC PROBE FPC BOARD MARKETREPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Ultrasonic probe FPC boards are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Ultrasonic probe FPC Board and key vendor selection criteria
3. Where is the Ultrasonic probe FPC Board manufactured? What is the average margin per unit?
4. Market share of Global Ultrasonic probe FPC Board market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Ultrasonic probe FPC Board in-house
6. key predictions for next 5 years in Global Ultrasonic probe FPC Board market
7. Average B-2-B Ultrasonic probe FPC Board market price in all segments
8. Latest trends in Ultrasonic probe FPC Board market, by every market segment
9. The market size (both volume and value) of the Ultrasonic probe FPC Board market in 2024-2030 and every year in between?
10. Production breakup of Ultrasonic probe FPC Board market, by suppliers and their OEM relationship