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The StencilWasher uses the power of sound waves to effectively remove raw solder paste and uncured adhesive from stencils, screens, and misprints. The StencilWasher’s 40 kHz ultrasonic generator provides a safe and effective cleaning environment for both the stencil and the mounted misprint assembly.
The cleaning solution is filtered and recirculated (closed circuit) by a built-in solder paste trap and filter system. Rinse water is filtered, re-deionized, and recirculated (closed loop), Remove all solder paste and uncured SMT adhesive.
The cleaning solution is filtered and circulated (closed circuit) by an integrated solder paste separator and filter system. Rinse water is filtered and sent to drain. Remove all solder paste The cleaning solution is filtered and recirculated (closed circuit) using an internal solder paste separator and filter system.
Rinse water is filtered and sent to drain. Manufacturer, supplier, and exporter of Ultrasonic Stencil cleaners in the global market located in, India. The ultrasonic stencil cleaning equipment provided by Many companies has various grades and specifications according to customer needs.
The ultrasonic stencil cleaner uses state-of-the-art ultrasonic technology for the cleaning process. Ultrasonic stencil cleaners are widely used in electronics and other fields as human-friendly and environmentally-friendly stencil cleaners designed specifically for cleaning substrate stencils and related components.
The ultrasonic stencil cleaning process can penetrate and remove solder paste, flux, or SMD adhesives into the smallest crevices more efficiently than spray cleaning or hand wiping, without the use of harmful solvents or harsh chemicals. It’s strong enough for dry pastes and gentle enough for fine grids, stencils, and misprints.
Global Ultrasonic Stencil Cleaning Machine market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Sawa Automatic Ultrasonic Stencil & Screen Cleaner SC-BM500E. This system is specifically designed for high-density SMT applications. The sawa SC-BM500E provides precise cleaning with an ultrasonic cleaning head designed for various applications such as wafer bumps and electroformed templates.
It supports a wide range of stencils from 320mm x 320mm to 1000 x 740mm, making it perfect for customers who use multiple types of stencils and screens.
