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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
The uncompensated pressure-sensor package is the most basic. In an uncompensated package, the MEMS die has been wire-bonded to the ceramic substrate's electrical traces, mounted to the ceramic substrate with a specific die-bond substance, and then coated with a protective cap or gel.
The output for each silicon die will be distinct because each one is uniquely created. Fortunately, the outputs of silicon die are exceedingly repeatable.
This indicates that the output can be adjusted.The customer will need to do some level of adjustment in order to obtain an accurate output.
There are some applications that are suitable for consumer compensation. The following are some of the elements that frequently decide whether Merit Sensor or the client performs the compensation:Price, Accuracy, Size, Signal Output.
The Global unCompensated Pressure Sensors market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
New Honeywell basic board mount pressure sensors that are unamplified and uncompensated. TTI, Inc., the world's top specialist distributor of passive, connector, electromechanical, and discrete components, now offers Honeywell's highly durable and robust NBP series basic board mount pressure sensors.
These sensors are designed for customers who need a simple, cost-effective, basic performance, mV output, unamplified, uncompensated, high quality, high resolution solution for medical and industrial applications.
The absolute and gauge pressures are measured by the unamplified and uncompensated NBP series sensors, which also provide infinite resolution for the pressure signal.
They are best suited for customers who want to apply a bespoke algorithm and do their own compensation, calibration, and amplification in order to use the maximum resolution of the raw sensor output.
Additionally,Device manufacturers will find it simpler to integrate the components into their applications because they are offered in a variety of package types and mounting configurations. Due to their extremely small size (as little as 7mm x 7mm), the devices take up less room on the PCB than the majority of board mount pressure sensors, making it simple to insert them in tight spaces or inside compact devices.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |