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When wafers or other microelectronic substrates are chopped into smaller pieces after being microfabricated into wafers or modules, this process is known as “dicing,” and the backing tape used during this process is called “dicing tape.”
UV tapes are dicing tapes in which the adhesive bond is broken after dicing by exposure to UV light, allowing the adhesive to be stronger during cutting while still allowing for clean and simple removal. A wafer or substrate can be held in place by dicing tape, which has a backing made of PVC, polyolefin, or polyethylene and an adhesive.
The Global UV dicing tape market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
A dicing tape that has been coated with a photoinitiator is the UV curable variety. The photoinitiator reacts with the adhesive’s monomers to form long-chain molecules or polymers when it is exposed to ultraviolet (UV) light. Between the adhesive and substrate, the ensuing polymerization creates a strong bind.
Adhesives made of acrylate and methacrylate are the most often used kinds of UV-curable adhesives. Glass, metals, and plastic are just a few of the substrates that can be employed with these adhesives.
Dicing tape is used in the production of wafers to assist shield the wafer’s surface from nicks and other damage. The wafer and diced die are separated cleanly as a result.
Additionally, one can use dicing tape as an adhesive to keep the dies in place when packaging. There are UV cured and non-UV cured dicing tapes available. The particular requirements of the application will determine the type to be used.
In the production of resin substrates, dicing tape is used to increase the precision and calibre of substrates that are diced. Additionally, it makes sure that the dice’s surfaces are germ-free and clean.
Additionally, it makes handling and processing of substrates much easier. Consequently, it is anticipated that during the projected period, demand for dicing tapes will increase in the resin substrate production market.
