VCSEL CHIP FOR 3D SENSOR MARKET

INTRODUCTION

In contrast to traditional edge-emitting semiconductor lasers (also known as in-plane lasers), which emanate from surfaces created by cleaving each individual chip out of a wafer, the vertical-cavity surface-emitting laser, or VCSEL, emits a laser beam perpendicular from the top surface.

The use of 3D sensing for facial recognition is currently widespread. 

It has a strong VCSEL technology reliance, and for good reason. Because of their natural capacity to emit light perpendicular to the chip surface and outward, VCSELs get their name. The combination of the VCSEL's ultra compact shape and high-quality beam output makes it the perfect technology for use in smartphones. 

VCSEL CHIP FOR 3D SENSOR MARKET   SIZE AND FORECAST

 The global VCSEL chip for 3D sensor market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

VCSEL CHIP FOR 3D SENSOR MARKET NEW PRODUCT LAUNCH

New high-power and high-efficiency five and six junction VCSEL arrays for sophisticated consumer, automotive LiDAR, and other 3D sensing applications were released by Lomenta Holdings Inc., a leading supplier of VCSEL arrays for 3D sensing and LiDAR applications.

LiDAR and 3D sensing are finding new uses in the industrial, automotive, and consumer electronics sectors. Greater power and efficiency from smaller form factor devices are required for new applications and functionality. In comparison to previous devices, Lomenta's cutting-edge five and six junction

VCSEL arrays offer significantly lower power dissipation, extremely high slope efficiencies, and record-breaking optical peak outputs. A small, one square millimeter-sized VCSEL array has produced peak optical powers of more than 800 W with optical powers exceeding 2 W per every VCSEL emitter.

These novel multi-junction VCSEL arrays' high performance all-solid-state medium and long-range LiDAR applications can benefit from their peak optical power, low thermal dissipation, and tiny die size.

The newest members of Osram opts Semiconductors' Bides product family, the PLPVCQ 850 and PLPVCQ 940, have been announced.

Machine vision or facial identification, as well as object or architectural scanning, which entails mapping an area in 3D and positioning virtual furniture and other items, are applications for the new Vertical Cavity Surface Emitting Lasers (VCSELs). When planning areas, the application helps save time and money.

VCSELs combine the spectrum width and speed of a laser with the high power density and straightforward packaging of an IRED. VCSELs are significantly less susceptible to temperature changes than laser diodes are.

Facial recognition on mobile devices is one of the technology's most well-known uses. .For cameras, VCSELs emit infrared light that illuminates the face. Then, the camera's image and the one that is stored on the device are compared. They must match for the device to be unlocked.

Time of Flight (ToF) measurements for these 3D sensing applications are now made possible by PLPVCQ 850 and PLPVCQ 940.

VCSEL CHIP FOR 3D SENSOR MARKET COMPANY PROFILE

• Lumentum
• TRUMPF
• Alight technologies 
• TTelectronics
• Coherent

THIS VCSEL CHIP FOR 3D SENSOR MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

1. What is the average cost perglobal VCSEL chip for the 3D sensor marketright now and how will it change in the next 5-6 years?
2. Average cost to set up aglobal VCSEL chip for the 3D sensor marketin the US, Europe and China?
3. How manyglobal VCSEL chips for the 3D sensor market aremanufactured per annum globally? Who are the sub-component suppliers in different regions?
4. What is happening in the overall public, globally?
5. Cost breakup of aglobal VCSEL chip for 3D sensor marketand key vendor selection criteria
6. Where is the globalVCSEL chip for the 3D sensor market manufactured? What is the average margin per equipment?
7. Market share of globalVCSEL chip for 3D sensor marketmanufacturers and their upcoming products
8. The most important plannedglobal VCSEL chip for 3D sensor marketin next 2 years
9. Details on network of majorglobal VCSEL chip for 3D sensor marketand pricing plans
10. Cost advantage for OEMs who manufactureglobal VCSEL chip for 3D sensor marketin-house
11. 5 key predictions for next 5 years inglobal VCSEL chip for 3D sensor market
12. Average B-2-Bglobal VCSEL chip for 3D sensor marketprice in all segments
13. Latest trends inglobal VCSEL chip for 3D sensor market, by every market segment
14. The market size (both volume and value) ofglobal VCSEL chip for 3D sensor marketin 2024-2030 and every year in between?
15. Global production breakup ofglobal VCSEL chip for 3D sensor market, by suppliers and their OEM relationship