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In the semiconductor industry, a vertical furnace—also called a vertical thermal reactor or vertical diffusion furnace—is a common piece of machinery used for a variety of thermal operations. It is crucial for the creation of silicon-based products like solar cells and integrated circuits (ICs).
The substrates or wafers are inserted vertically into the reaction chamber, giving rise to the moniker “vertical furnace” due to this structure. It comprises of a cylindric quartz or graphite tube surrounded by graphite or molybdenum-based heating components. The chamber is heated consistently throughout by the heating components.
A vertical furnace’s main use is to conduct high-temperature operations including chemical vapour deposition (CVD), thermal oxidation, diffusion, and annealing.
Controlling the qualities and features of the thin films and layers that are deposited on semiconductor wafers is essential thanks to these techniques. A thin coating of silicon dioxide (SiO2) is generated on the surface of the silicon wafer during the conventional process of thermal oxidation, which is carried out in a vertical furnace. For the next manufacturing procedures, this layer acts as an insulator or shield.
Another crucial step in the production of semiconductors is diffusion, which involves adding dopant atoms to the silicon wafer to change its electrical characteristics. The dopant source material is heated at a high temperature in a vertical furnace, where the dopant atoms diffuse into the silicon wafer.
The Global Vertical Furnace Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Launch of the Sonora vertical boiler system by ASM International N.V. Because the new SONORA® and the old A412TM are completely interoperable, it is simple to transfer current process recipes, expediting system validation and scale up.
Multiple clients worldwide have started receiving systems, including industry leaders in the production of power devices and sophisticated logic.In comparison to its predecessor, productivity has increased because to the bigger process wafer load sizes, upgraded control system, new robots, quicker wafer cooling, and faster boat interchange modules.
Lower energy and chemical use per wafer is another benefit of higher production. A special focus on serviceability in the design resulted in a roomy access for all maintenance tasks.
An elegant graphical user interface, predictive maintenance through enhanced control diagnostics, and other modern features have been added to the new system.