GLOBAL WAFER BACK-SIDE CLEANING SYSTEM MARKET

INTRODUCTION

 In a processing chamber, a silicon wafer or another type of wafer is processed during the creation of a semiconductor device. Layers of diverse materials can be deposited, patterned, and etched across the silicon wafer during various production processes.

Processing, however, may introduce pollutants into the processing environment, which may have a negative impact on the device that results or the quality of the deposited layer(s).

For instance, dust or etched material may come into contact with the surface of the wafer, which could interfere with the photolithography or etching processes as well as the deposition of a layer by generating flaws in the layer.

a wafer support is surrounded by an electrically conductive ring that is roughly in the same plane as the wafer, and the ring divides the chamber into an upper and a lower section.

The ring includes an outer ring portion that is thicker than the inner ledge and is outside the inner ledge as well as the outer circumference of the wafer to allow a pressure balance between the upper and lower portions, as well as a recessed inner ledge that is on the same plane as the wafer and extends underneath the wafer to support the wafer.

GLOBAL WAFER BACK-SIDE CLEANING SYSTEM MARKET SIZE AND FORECAST

 The Global Wafer Back-side Cleaning System market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

NEW PRODUCT LAUNCH

The CELLESTA SCD single wafer Back-side cleaning system was launched by Tokyo Electron (TEL). TEL's CELLESTA range of devices are frequently used for cleaning silicon wafers throughout the semiconductor production process.

The soon-to-be-available CELLESTA SCD incorporates a special supercritical drying chamber on the CELLESTA platform, which has been successfully used in mass production. Low surface tension alcohol solutions are typically used in the drying step of wafer cleaning.

However, pattern collapse during the drying process has emerged as one of the main problems as a result of continuing semiconductor scaling and the usage of multi-layer architectures in highly advanced devices.

TEL has created a pattern collapse-free drying technique that employs a supercritical fluid in reaction and has introduced the technology to the market as machinery for mass production.

COMPANY PROFILE

• Tokyo Electron 
• EV Group
• ASML
• FormFactor
• Plasma-Therm

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Wafer Back-side Cleaning System are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Wafer Back-side Cleaning System and key vendor selection criteria
3. Where is the Wafer Back-side Cleaning System manufactured? What is the average margin per unit?
4. Market share of Global Wafer Back-side Cleaning System market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Wafer Back-side Cleaning System in-house
6. key predictions for next 5 years in Global Wafer Back-side Cleaning System market
7. Average B-2-B Wafer Back-side Cleaning System market price in all segments
8. Latest trends in Wafer Back-side Cleaning System market, by every market segment
9. The market size (both volume and value) of the Wafer Back-side Cleaning System market in 2023-2030 and every year in between?
10. Production breakup of Wafer Back-side Cleaning System market, by suppliers and their OEM relationship